Abstract: An adapter assembly is provided for supporting a sputtering cathode in a fixed opening in the chamber of a sputter coating machine. The assembly includes: one of several adapter bodies, each configured to support, in the fixed opening, a target of one of a plurality of sizes and types, and at one of several target-to-substrate spacings; one of several insulator rings, each for a target of a different size or type; one of several dark-space shields, each for a target of a different size, type, material, or processing pressure; and one of several adapter shields, each for a different adapter body and target material. Only the shields accumulate deposits and require cleaning or replacement. The dark-space shield is spaced from the target rim by a gap of at 0.045 to 0.067 inches to form a deep narrow space that prevents deposits onto the insulator ring while avoiding arcing and plasma formation in the gap.

Abstract: An adapter assembly is provided for supporting a sputtering cathode in a fixed opening in the chamber of a sputter coating machine. The assembly includes: one of several adapter bodies, each configured to support, in the fixed opening, a target of one of a plurality of sizes and types, and at one of several target-to-substrate spacings; one of several insulator rings, each for a target of a different size or type; one of several dark-space shields, each for a target of a different size, type, material, or processing pressure; and one of several adapter shields, each for a different adapter body and target material. Only the shields accumulate deposits and require cleaning or replacement. The dark-space shield is spaced from the target rim by a gap of at 0.045 to 0.067 inches to form a deep narrow space that prevents deposits onto the insulator ring while avoiding arcing and plasma formation in the gap.

Abstract: A replacement chamber shield is provided for a wafer processing machine that replaces many prior art shield components with a single piece shield. The shield is particularly suitable for use in a processing chamber of a vacuum processing machine of a type for processing a wafer in a vertically-oriented split-plenum, such as machines of the type described in U.S. Pat. Nos. 4,909,695 and 4,915,564 and the machine marketed under the trademark ECLIPSE MARK II by Tokyo Electron Limited. The shield is formed of sheet material formed into an axially-extending cylindrical sidewall that turns radially inwardly into an annular shoulder that oppositely turns into an at least partially axially-extending section that further turns oppositely back radially inwardly into an annular disc having a central circular opening that is larger in diameter than the given wafer diameter. Advantageous dimensions and geometric relationships to components of the machine are described and claimed.

Abstract: An adapter assembly is provided for supporting a sputtering cathode in a fixed opening in the chamber of a sputter coating machine. The assembly includes: one of several adapter bodies, each configured to support, in the fixed opening, a target of one of a plurality of sizes and types, and at one of several target-to-substrate spacings; one of several insulator rings, each for a target of a different size or type; one of several dark-space shields, each for a target of a different size, type, material, or processing pressure; and one of several adapter shields, each for a different adapter body and target material. Only the shields accumulate deposits and require cleaning or replacement. The dark-space shield is spaced from the target rim by a gap of at 0.045 to 0.067 inches to form a deep narrow space that prevents deposits onto the insulator ring while avoiding arcing and plasma formation in the gap.

Abstract: A replacement chamber shield is provided for a wafer processing machine that replaces many prior art shield components with a single piece shield. The shield is particularly suitable for use in a processing chamber of a vacuum processing machine of a type for processing a wafer in a vertically-oriented split-plenum, such as machines of the type described in U.S. Pat. Nos. 4,909,695 and 4,915,564 and the machine marketed under the trademark Eclipse Mark II by Tokyo Electron Limited. The shield is formed of sheet material formed into an axially-extending cylindrical sidewall that turns radially inwardly into an annular shoulder that oppositely turns into an at least partially axially-extending section that further turns oppositely back radially inwardly into an annular disc having a central circular opening that is larger in diameter than the given wafer diameter. Advantageous dimensions and geometric relationships to components of the machine are described and claimed.