Abstract: Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.

Abstract: A packaged memory device for storing information comprises a stack, a package lid, a first magnet structure fixedly connected to the package lid, a package body and a second magnet structure connected with the package body. The stack includes a tip substrate, a cap, and a media arranged between the tip substrate and cap and movable relative to the tip substrate. The tip substrate includes a plurality of tips extending from the tip substrate so that the tips can access the media. The first magnet structure includes a first magnet connected with a first flux plate. The second magnet structure includes a second magnet connected with a second flux plate. The second flux plate is integrated with the package body so that the second flux plate provides structural rigidity to the package body. The stack is connected to one or both of the package body and the second magnet.

Abstract: Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.

Abstract: A MEMS die is bonded to a cap to form a MEMS device. The cap is non-silicon and has an electrical via extending from one side of the cap to another side of the cap. In one embodiment, a plurality of caps is wafer bonded to a plurality of MEMS dice.

Abstract: In one embodiment, the invention provides a method comprising supporting a plurality of active electronic components on a first wafer; shaping a second wafer to define a plurality of spaces, each to accommodate one of the active electronic components when the second wafer is aligned and brought into face-to-face contact with that first wafer in a contact position; moving the second wafer into the contact position; and bonding the second wafer to the first wafer in the contact position.

Abstract: In one embodiment, the invention provides a method comprising supporting a plurality of active electronic components on a first wafer; shaping a second wafer to define a plurality of spaces, each to accommodate one of the active electronic components when the second wafer is aligned and brought into face-to-face contact with that first wafer in a contact position; moving the second wafer into the contact position; and bonding the second wafer to the first wafer in the contact position.