Abstract: Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.

Abstract: An electronics assembly (48) is disclosed that utilizes a filter (24) within a plenum (50). The filter (24) may be electrically isolated from at least certain portions of the electronics assembly (48) by an electrical insulator (64). The electronics assembly (48) furthermore alleviates the need for a separate filter tray, and in this regard it may be such that only a first filter end (80) and a second filter end (82) of the filter (24) are supported within the electronics assembly (48).

Abstract: The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insurers that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.

Abstract: The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insurers that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.

Abstract: Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.