Patents by Inventor Steve L. Eudy
Steve L. Eudy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7934898Abstract: A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading tracks. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. One or more process robots in a process module move wafers from buffers, or other locations, to processors in the process module.Type: GrantFiled: July 16, 2007Date of Patent: May 3, 2011Assignee: Semitool, Inc.Inventors: Randy A. Harris, Steve L. Eudy, Paul Z. Wirth
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Publication number: 20090024244Abstract: A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading tracks. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. One or more process robots in a process module move wafers from buffers, or other locations, to processors in the process module.Type: ApplicationFiled: July 16, 2007Publication date: January 22, 2009Inventors: Randy A. Harris, Steve L. Eudy, Paul Z. Wirth
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Publication number: 20090022574Abstract: A wafer loading system accommodates sufficient wafer carriers to substantially maximize the processing speed capability of wafer processing systems. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading elements, such as overhead track systems. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. Methods of operating the loading system allow delivery and removal of wafers to and from the processing systems to meet or exceed the processing speeds of the processing systems.Type: ApplicationFiled: July 16, 2007Publication date: January 22, 2009Inventors: Steve L. Eudy, Randy A. Harris, Paul Z. Wirth
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Patent number: 7294243Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the workpiece and a plurality of contacts (420). The individual contacts (420) include a conductor (440) and a cover (430). The conductor (440) can comprise a proximal section (435) projecting inwardly into the opening (414) relative to the support member (410), a distal section (436) extending from the proximal section (435), and an inert exterior (444) at least at the distal section (436). The cover (430) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.Type: GrantFiled: December 5, 2002Date of Patent: November 13, 2007Assignee: Semitool, Inc.Inventors: Nolan Zimmerman, Gregory J. Wilson, Steve L. Eudy
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Patent number: 7161689Abstract: A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a process sequence of the processing apparatus based on a feed forward or a feed back signal from the metrology unit. A seed layer deposition tool, a process layer electrochemical deposition tool, and a chemical mechanical polishing tool, arranged for sequential processing of a workpiece, can be controlled as an integrated system using one or more metrology units. A metrology unit can be located at each tool to measure workpiece parameters. Each of the metrology units can be used as a feed forward control and/or a feed back control at each of the tools.Type: GrantFiled: October 14, 2003Date of Patent: January 9, 2007Assignee: Semitool, Inc.Inventors: Thomas L. Ritzdorf, Steve L. Eudy, Gregory J. Wilson, Paul R. McHugh
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Patent number: 7102763Abstract: A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.Type: GrantFiled: July 9, 2001Date of Patent: September 5, 2006Assignee: Semitool, Inc.Inventors: Thomas L. Ritzdorf, Steve L. Eudy, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Brian Aegerter, Curt Dundas, Steven L. Peace
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Patent number: 6962649Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.Type: GrantFiled: December 5, 2001Date of Patent: November 8, 2005Assignee: Semitool, Inc.Inventors: Gregory J. Wilson, John M. Pedersen, Steve L. Eudy
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Patent number: 6921467Abstract: Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit.Type: GrantFiled: June 15, 2001Date of Patent: July 26, 2005Assignee: Semitool, Inc.Inventors: Kyle M. Hanson, Steve L. Eudy, Thomas L. Ritzdorf, Gregory J. Wilson, Daniel J. Woodruff, Randy Harris, Curtis A. Weber, Tim McGlenn, Timothy A. Anderson, Daniel P. Bexten
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Patent number: 6916412Abstract: An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of walls 510 defining a plurality of electrode compartments 520, each electrode compartment having at least one electrode 600 therein, and a virtual electrode unit 530 defining a plurality of flow conduits, with at least one of the flow conduits being in fluid communication with each of the electrode compartments. This first virtual electrode unit 530 may be exchanged for a second virtual electrode unit 540, without modification of any of the electrodes 600, to adapt the processing chamber 200 for treating a different workpiece.Type: GrantFiled: June 5, 2001Date of Patent: July 12, 2005Assignee: Semitool, Inc.Inventors: Daniel J. Woodruff, Kyle M. Hanson, Steve L. Eudy, Curtis A. Weber, Randy Harris
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Patent number: 6747734Abstract: A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a process sequence of the processing apparatus based on a feed forward or a feed back signal from the metrology unit. A seed layer deposition tool, a process layer electrochemical deposition tool, and a chemical mechanical polishing tool, arranged for sequential processing of a workpiece, can be controlled as an integrated system using one or more metrology units. A metrology unit can be located at each tool to measure workpiece parameters. Each of the metrology units can be used as a feed forward control and/or a feed back control at each of the tools.Type: GrantFiled: July 8, 2000Date of Patent: June 8, 2004Assignee: Semitool, Inc.Inventors: Thomas L. Ritzdorf, Steve L. Eudy, Gregory J. Wilson, Paul R. McHugh
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Patent number: 6632334Abstract: An apparatus and method for processing microelectronic workpieces. The apparatus can include a housing at least partially enclosing a process environment, with a first processing chamber and a second processing chamber positioned within the housing. The first processing chamber can have a first electrically powered device, such as a first anode and/or a first cathode, and the second processing chamber can have a second electrically powered device, such as a second anode and/or a second cathode. A first power supply is electrically coupled to the first processing chamber to provide electrical power to at least one of a first anode and a first cathode, and a second power supply is electrically coupled to the second processing chamber to provide electrical power to at least one of the second anode and the second cathode.Type: GrantFiled: June 5, 2001Date of Patent: October 14, 2003Assignee: Semitool, Inc.Inventors: Timothy A. Anderson, Tim McGlenn, Steve L. Eudy
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Publication number: 20030141185Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.Type: ApplicationFiled: December 5, 2001Publication date: July 31, 2003Inventors: Gregory J. Wilson, John M. Pedersen, Steve L. Eudy
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Publication number: 20030066752Abstract: An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpiece to deposit a subsequent film layer onto a prior layer, wherein a condition signal from the metrology unit influences the process control of the electrochemical deposition unit. The signal can also be used to transfer the microelectronic workpiece to a layer stripping unit, or a layer enhancement unit, or to a non-compliance station. The apparatus is particularly useful in measuring seed layer thickness and adjusting the operating control of a computational fluid dynamic reactor, which electroplates a process layer onto the seed layer.Type: ApplicationFiled: August 6, 2002Publication date: April 10, 2003Inventors: Thomas L. Ritzdorf, Steve L. Eudy, Gregory J. Wilson, Paul R. McHugh
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Publication number: 20030020928Abstract: A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.Type: ApplicationFiled: July 9, 2001Publication date: January 30, 2003Inventors: Thomas L. Ritzdorf, Steve L. Eudy, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Brian Aegerter, Curt Dundas, Steven L. Peace
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Publication number: 20020179436Abstract: An apparatus and method for processing microelectronic workpieces. The apparatus can include a housing at least partially enclosing a process environment, with a first processing chamber and a second processing chamber positioned within the housing. The first processing chamber can have a first electrically powered device, such as a first anode and/or a first cathode, and the second processing chamber can have a second electrically powered device, such as a second anode and/or a second cathode. A first power supply is electrically coupled to the first processing chamber to provide electrical power to at least one of a first anode and a first cathode, and a second power supply is electrically coupled to the second processing chamber to provide electrical power to at least one of the second anode and the second cathode.Type: ApplicationFiled: June 5, 2001Publication date: December 5, 2002Inventors: Timothy A. Anderson, Tim McGlenn, Steve L. Eudy
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Patent number: 6428673Abstract: An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpiece to deposit a subsequent film layer onto a prior layer, wherein a condition signal from the metrology unit influences the process control of the electrochemical deposition unit. The signal can also be used to transfer the microelectronic workpiece to a layer stripping unit, or a layer enhancement unit, or to a non-compliance station. The apparatus is particularly useful in measuring seed layer thickness and adjusting the operating control of a computational fluid dynamic reactor, which electroplates a process layer onto the seed layer.Type: GrantFiled: July 8, 2000Date of Patent: August 6, 2002Assignee: Semitool, Inc.Inventors: Thomas L. Ritzdorf, Steve L. Eudy, Gregory J. Wilson, Paul R. McHugh
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Publication number: 20020053509Abstract: Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit.Type: ApplicationFiled: June 15, 2001Publication date: May 9, 2002Inventors: Kyle M. Hanson, Steve L. Eudy, Thomas L. Ritzdorf, Gregory J. Wilson, Daniel J. Woodruff, Randy Harris, Curtis A. Weber, Tim McGlenn, Timothy A. Anderson, Daniel P. Bexten
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Publication number: 20010032788Abstract: An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of walls 510 defining a plurality of electrode compartments 520, each electrode compartment having at least one electrode 600 therein, and a virtual electrode unit 530 defining a plurality of flow conduits, with at least one of the flow conduits being in fluid communication with each of the electrode compartments. This first virtual electrode unit 530 may be exchanged for a second virtual electrode unit 540, without modification of any of the electrodes 600, to adapt the processing chamber 200 for treating a different workpiece.Type: ApplicationFiled: June 5, 2001Publication date: October 25, 2001Inventors: Daniel J. Woodruff, Kyle M. Hanson, Steve L. Eudy, Curtis A. Weber, Randy Harris