Abstract: A feed-through terminal block module includes first and second electrical terminals, a first current bar, and a second current bar, the terminals and current bars in a terminal housing. The first current bar permanently electrically connects the first and second terminals. The first current bar includes a first contact portion of the module. The second current bar includes a second contact portion of the module and a third contact portion of the module. A removable contact plug is inserted into the housing to selectively electrically connect the first and second contact portions. Removable bridge pins or a bridging current bar electrically connects the third contact portions of adjacent modules when modules are placed side-by-side to form a terminal block.

Abstract: An integrated circuit may include a metal gate which extends over an active area and onto an isolation dielectric layer. A conductive spline is formed on the metal gate, extending on the metal gate over at least a portion of the isolation dielectric layer, and extending on the metal gate for a length at least four times a width of the metal gate.

Abstract: An integrated circuit may include a metal gate which extends over an active area and onto an isolation dielectric layer. A conductive spline is formed on the metal gate, extending on the metal gate over at least a portion of the isolation dielectric layer, and extending on the metal gate for a length at least four times a width of the metal gate.

Abstract: An integrated circuit may include a metal gate which extends over an active area and onto an isolation dielectric layer. A conductive spline is formed on the metal gate, extending on the metal gate over at least a portion of the isolation dielectric layer, and extending on the metal gate for a length at least four times a width of the metal gate.

Abstract: An integrated circuit includes a component with a metal gate NMOS transistor and a metal gate PMOS transistor in which a metal gate structure of the NMOS transistor is disposed in electrical series with, and abuts, a metal gate structure of the PMOS transistor. A gate shunt is formed over a boundary between the metal gate structure of the NMOS transistor and the metal gate structure of the PMOS transistor. The gate shunt provides a low resistance connection between the metal gate structure of the NMOS transistor and the metal gate structure of the PMOS transistor. The gate shunt is free of electrical connections to other components through interconnect elements of the integrated circuit.

Abstract: An integrated circuit may include a metal gate which extends over an active area and onto an isolation dielectric layer. A conductive spline is formed on the metal gate, extending on the metal gate over at least a portion of the isolation dielectric layer, and extending on the metal gate for a length at least four times a width of the metal gate.

Abstract: The width of a metal contact opening is formed to be smaller than the minimum feature size of a photolithographically-defined opening. The method forms the metal contact opening by first etching the fourth layer of a multilayered hard mask structure to have a number of trenches that expose the third layer of the multilayered hard mask structure. Following this, the third, second, and first layers of the multilayered hard mask structure are selectively etched to expose uncovered regions on the top surface of an isolation layer that touches and lies over a source region and a drain region. The uncovered regions on the top surface of the isolation layer are then etched to form the metal contact openings.

Abstract: The width of a metal contact opening is formed to be smaller than the minimum feature size of a photolithographically-defined opening. The method forms the metal contact opening by first etching the fourth layer of a multilayered hard mask structure to have a number of trenches that expose the third layer of the multilayered hard mask structure. Following this, the third, second, and first layers of the multilayered hard mask structure are selectively etched to expose uncovered regions on the top surface of an isolation layer that touches and lies over a source region and a drain region. The uncovered regions on the top surface of the isolation layer are then etched to form the metal contact openings.

Abstract: A cleaning apparatus (1100) for cleaning an endface (1104) of an optical fiber (1106), wherein a portion of the optical fiber is contained within an interface device (1103) is provided. The cleaning apparatus includes a housing (1114) having an interface portion (1124) adapted to be received by the interface device. The cleaning apparatus further includes a fluid dispensing assembly (1116) at least partially disposed within the housing, wherein at least a portion (1112) of the fluid dispensing assembly engages the endface when the interface portion is received by the interface device. The fluid dispensing assembly is operable to deliver a fluid and a solvent upon the endface when the interface portion of the housing is received by the interface device to aid in the removal of contaminants on the endface. The cleaning apparatus may include a contact cleaning assembly (1304) and/or a microscope (1408).

Abstract: A cleaning apparatus (1100) for cleaning an endface (1104) of an optical fiber (1106), wherein a portion of the optical fiber is contained within an interface device (1103) is provided. The cleaning apparatus includes a housing (1114) having an interface portion (1124) adapted to be received by the interface device. The cleaning apparatus further includes a fluid dispensing assembly (1116) at least partially disposed within the housing, wherein at least a portion (1112) of the fluid dispensing assembly engages the endface when the interface portion is received by the interface device. The fluid dispensing assembly is operable to deliver a fluid and a solvent upon the endface when the interface portion of the housing is received by the interface device to aid in the removal of contaminants on the endface. The cleaning apparatus may include a contact cleaning assembly (1304) and/or a microscope (1408).

Abstract: A cleaning apparatus (1100) for cleaning an endface (1104) of an optical fiber (1106), wherein a portion of the optical fiber is contained within an interface device (1103) is provided. The cleaning apparatus includes a housing (1114) having an interface portion (1124) adapted to be received by the interface device. The cleaning apparatus further includes a fluid dispensing assembly (1116) at least partially disposed within the housing, wherein at least a portion (1112) of the fluid dispensing assembly engages the endface when the interface portion is received by the interface device. The fluid dispensing assembly is operable to deliver a fluid and a solvent upon the endface when the interface portion of the housing is received by the interface device to aid in the removal of contaminants on the endface. The cleaning apparatus may include a contact cleaning assembly (1304) and/or a microscope (1408).

Abstract: A film structure includes low-k dielectric films and N—H base source films such as barrier layer films, etch-stop films and hardmask films. Interposed between the low-k dielectric film and adjacent N—H base film is a TEOS oxide film which suppresses the diffusion of amines or other N—H bases from the N—H base source film to the low-k dielectric film. The film structure may be patterned using DUV lithography and a chemically amplified photoresist since there are no base groups present in the low-k dielectric films to neutralize the acid catalysts in the chemically amplified photoresist.

Abstract: A cleaning apparatus (1100) for cleaning an endface (1104) of an optical fiber (1106), wherein a portion of the optical fiber is contained within an interface device (1103) is provided. The cleaning apparatus includes a housing (1114) having an interface portion (1124) adapted to be received by the interface device. The cleaning apparatus further includes a fluid dispensing assembly (1116) at least partially disposed within the housing, wherein at least a portion (1112) of the fluid dispensing assembly engages the endface when the interface portion is received by the interface device. The fluid dispensing assembly is operable to deliver a fluid and a solvent upon the endface when the interface portion of the housing is received by the interface device to aid in the removal of contaminants on the endface. The cleaning apparatus may include a contact cleaning assembly (1304) and/or a microscope (1408).

Abstract: A method and apparatus for preventing excessive closure between a retractable tip objective and the stage of a microscope which includes positioning a sensor in the turret of a microscope, which sensor is capable of detecting excessive retracting of the retractable tip into the body of the objective, and providing a controller for monitoring the sensor for such excessive retracting and issuing an alert in response to the detection of an event of such excessive retracting. The alert may be made by way of an audio output, or by a visual cue or both. Extinguishing the lamp of the microscope is a preferred visual cue, as the excessive retracting of the retractable tip is generally caused by a focusing error, and the extinguishing of the light source reduces or eliminates the ability of the user of the microscope to focus the microscope, thus attracting his or her attention.

Abstract: A film structure includes low-k dielectric films and N—H base source films such as barrier layer films, etch-stop films and hardmask films. Interposed between the low-k dielectric film and adjacent N—H base film is a TEOS oxide film which suppresses the diffusion of amines or other N—H bases from the N—H base source film to the low-k dielectric film. The film structure may be patterned using DUV lithography and a chemically amplified photoresist since there are no base groups present in the low-k dielectric films to neutralize the acid catalysts in the chemically amplified photoresist.

Abstract: A method and apparatus for preventing excessive closure between a retractable tip objective and the stage of a microscope which includes positioning a sensor in the turret of a microscope, which sensor is capable of detecting excessive retracting of the retractable tip into the body of the objective, and providing a controller for monitoring the sensor for such excessive retracting and issuing an alert in response to the detection of an event of such excessive retracting. The alert may be made by way of an audio output, or by a visual cue or both. Extinguishing the lamp of the microscope is a preferred visual cue, as the excessive retracting of the retractable tip is generally caused by a focusing error, and the extinguishing of the light source reduces or eliminates the ability of the user of the microscope to focus the microscope, thus attracting his or her attention.