Abstract: A high density backplane (HDB) connector is provided for electrically interconnecting high density printed circuit boards. The printed circuit boards have a predetermined geometric conductive pattern which includes high density arrays of individual signal/power contact interconnects and unitary ground strips. The HDB connector comprises a housing module secured to one board and a stiffener module secured to a second board. A compliant contact module mounted within the housing module includes a resilient member, an insulator member having arrays of free-floating rigid contact pins disposed therein, and a flexile film interposed therebetween. The flexile film has a signal/power conductive matrix formed on one side and a continuous ground plane formed on the other side. The compliant contact module further includes prestressed early-mate ground contacts and a plurality of distributed resilient ground contacts. Circuit board mating is effected by pressing the stiffener module down onto the housing module.