Patents by Inventor Steve R. Eskildsen

Steve R. Eskildsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconducting device with folded interposer
    Patent number: 7482698
    Abstract: Some embodiments of the present invention relate to a semiconducting device that includes an interposer having a fold which divides the interposer into a first section and a second section. A first die is attached to a first surface of the interposer at the first and second sections of the interposer. The semiconducting device further includes a contact that is attached to the first surface of the interposer at the first section and the second section. A second die is attached to a second surface of the interposer such that the second die is stacked onto the first die and is electrically coupled to the first die by the contact and conductive paths that are part of the interposer.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: January 27, 2009
    Assignee: Intel Corporation
    Inventors: Iwen Chao, Steve R. Eskildsen
  • Semiconducting device with folded interposer
    Patent number: 7456048
    Abstract: Some embodiments of the present invention relate to a semiconducting device that includes an interposer having a fold which divides the interposer into a first section and a second section. A first die is attached to a first surface of the interposer at the first and second sections of the interposer. The semiconducting device further includes a contact that is attached to the first surface of the interposer at the first section and the second section. A second die is attached to a second surface of the interposer such that the second die is stacked onto the first die and is electrically coupled to the first die by the contact and conductive paths that are part of the interposer.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: November 25, 2008
    Assignee: Intel Corporation
    Inventors: Iwen Chao, Steve R. Eskildsen
  • Semiconducting device with folded interposer
    Patent number: 7145249
    Abstract: Some embodiments of the present invention relate to a semiconducting device that includes an interposer having a fold which divides the interposer into a first section and a second section. A first die is attached to a first surface of the interposer at the first and second sections of the interposer. The semiconducting device further includes a contact that is attached to the first surface of the interposer at the first section and the second section. A second die is attached to a second surface of the interposer such that the second die is stacked onto the first die and is electrically coupled to the first die by the contact and conductive paths that are part of the interposer.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: December 5, 2006
    Assignee: Intel Corporation
    Inventors: Iwen Chao, Steve R. Eskildsen