Abstract: Implementations described and claimed herein provide systems and methods for sorting disc objects, such as coins, into customizable combinations. In one implementation, a singulator is configured to isolate a disc object from a batch of disc objects. A rail is disposed relative to the singulator, and gravity directs the disc object through the singulator onto the rail. A discriminator determines a size and a composition of the disc object as the disc object travels along the rail. The discriminator determines a denomination and a validity of the disc object based on the size and the composition. A sorter is in communication with the discriminator. The sorter ejects the disc object into a chute corresponding to the denomination and the validity.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: An installed vehicle security system having at least one multidirectional atomizing nozzle positioned on the vehicle adjacent a target zone. A disabling fluid is held in a pressurized canister in fluid communication with the nozzles. Foot and hand triggers, including remote triggers, are provided for releasing an amount of disabling fluid from the nozzles effective to saturate the target area. The canister is under constant pressure, independent of the vehicle's engine; the triggers are powered independently of the vehicle's ignition system; and the nozzles are pre-positioned so that the security system of this invention is constantly ready for rapid and unobtrusive actuation. A detachable vehicle security system is also provided.