Abstract: A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared with an image a component from the exchanged feeder placed after the feeder exchange. A comparison of the pre-exchange image with the post-exchange image facilitates simple and quick feeder exchange validation. Aspects of the present invention are practicable with different types of pick and place machines, and are able to advantageously use sensors and/or technician supplied information to generate automatic indications of feeder exchange validity.

Abstract: A pick and place machine includes a placement head configured to releasably grasp a component for placement. A robotic system is coupled to the placement head to generate relative movement between the placement head and a workpiece. An image acquisition system is configured to acquire at least one image of an intended placement location of the component before the component is placed. A controller is operably coupled to the image acquisition system, the controller is configured to process at least one before-placement image to generate a metric relative to solder deposited at the intended placement location.

Abstract: A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared with an image a component from the exchanged feeder placed after the feeder exchange. A comparison of the pre-exchange image with the post-exchange image facilitates simple and quick feeder exchange validation. Aspects of the present invention are practicable with different types of pick and place machines, and are able to advantageously use sensors and/or technician supplied information to generate automatic indications of feeder exchange validity.

Abstract: A pick and place machine includes a sensor disposed to acquire an image of a nozzle before a pick operation, and one or more images after the pick operation. Image analytics based upon these images reveal important characteristics that can be used to classify the pick operation. In some embodiments, a plurality of after-pick images are acquired at different poses (angular orientations).

Abstract: An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.

Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include inspecting the pick operation in pick and place machines by collecting images of the pick event inside the machine and identifying errors as they happen. By detecting and displaying this information as it generated on the machine, the operator or machine can take prompt and effective corrective actions.

Abstract: The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image.

Abstract: A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared with an image a component from the exchanged feeder placed after the feeder exchange. A comparison of the pre-exchange image with the post-exchange image facilitates simple and quick feeder exchange validation. Aspects of the present invention are practicable with different types of pick and place machines, and are able to advantageously use sensors and/or technician supplied information to generate automatic indications of feeder exchange validity.

Abstract: An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to a substrate. A plurality of optical modules mount on the substrate to form the optical device. The alignment compensation module removes residual alignment errors of the optical device.

Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include measuring the travel of a pick and place machine placement nozzle and the motion characteristics of the workpiece through the placement process. Since the component is placed on the workpiece with some force to ensure proper adhesion to the workpiece, some deflection of the workpiece is expected during the placement cycle. The placement force is adjusted to ensure that the component is safely placed into the solder paste or adhesive. Placement force is adjusted through a number of characteristics including: choice of spring tension in the nozzle; the length of the nozzle and the amount of over-travel into the board; the rigidity of the board and design; and the placement of the board support mechanisms. With proper adjustment of these characteristics and parameters, high quality placements onto the workpiece can be ensured.