Patents by Inventor Steven Cordes
Steven Cordes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11455522Abstract: A mobile electronic device such as a smartphone is used in conjunction with a deep learning system to detect and respond to personal danger. The deep learning system monitors current information (such as location, audio, biometrics, etc.) from the smartphone and generates a risk score by comparing the information to a routine profile for the user. If the risk score exceeds a predetermined threshold, an alert is sent to the smartphone which presents an alert screen to the user. The alert screen allows the user to cancel the alert (and notify the deep learning system) or confirm the alert (and immediately transmit an emergency message). Multiple emergency contacts can be designated, e.g., one for a low-level risk, another for an intermediate-level risk, and another for a high-level risk, and the emergency message can be sent to a selected contact depending upon the severity of the risk score.Type: GrantFiled: November 17, 2017Date of Patent: September 27, 2022Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Michael S. Gordon, Nigel Hinds, Maja Vukovic
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Patent number: 11349790Abstract: A method includes storing as communications data at least a portion of received electronic communications, such as emails, that are of interest to user; processing the stored communications data to identify at least one action item that pertains to the user; storing results of the processing including text descriptive of the at least one identified action item in a results repository; and outputting stored results in the results repository to a user device for review by the user. Also disclosed is a computer program product and a system that are configured to implement the method.Type: GrantFiled: December 22, 2014Date of Patent: May 31, 2022Assignee: International Business Machines CorporationInventors: Steven Cordes, Debra Leach Riell, Debra A. Loussedes, Patrick Varekamp
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Patent number: 10424185Abstract: A mobile electronic device such as a smartphone is used in conjunction with a deep learning system to detect and respond to personal danger. The deep learning system monitors current information (such as location, audio, biometrics, etc.) from the smartphone and generates a risk score by comparing the information to a routine profile for the user. If the risk score exceeds a predetermined threshold, an alert is sent to the smartphone which presents an alert screen to the user. The alert screen allows the user to cancel the alert (and notify the deep learning system) or confirm the alert (and immediately transmit an emergency message). Multiple emergency contacts can be designated, e.g., one for a low-level risk, another for an intermediate-level risk, and another for a high-level risk, and the emergency message can be sent to a selected contact depending upon the severity of the risk score.Type: GrantFiled: November 17, 2017Date of Patent: September 24, 2019Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Michael S. Gordon, Nigel Hinds, Maja Vukovic
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Patent number: 10324994Abstract: Resolving a query received from a first node in a network includes accepting, by a second node in the network, ownership of the query from the first node, receiving, at the second node, an identification of a third node in the network, wherein the identification is received from a user of the second node and the user of the second node believes that a user of the third node has information necessary to resolve at least part of the query, and transferring, by the second node, ownership of the at least part of the query to the third node, wherein the accepting, the receiving, and the transferring dynamically generates a data structure that traces a propagation of the query, and the data structure is accessible to an origin of the query.Type: GrantFiled: March 1, 2018Date of Patent: June 18, 2019Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Debra C. Leach, Debra A. Loussedes, Patrick R. Varekamp
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Publication number: 20190156655Abstract: A mobile electronic device such as a smartphone is used in conjunction with a deep learning system to detect and respond to personal danger. The deep learning system monitors current information (such as location, audio, biometrics, etc.) from the smartphone and generates a risk score by comparing the information to a routine profile for the user. If the risk score exceeds a predetermined threshold, an alert is sent to the smartphone which presents an alert screen to the user. The alert screen allows the user to cancel the alert (and notify the deep learning system) or confirm the alert (and immediately transmit an emergency message). Multiple emergency contacts can be designated, e.g., one for a low-level risk, another for an intermediate-level risk, and another for a high-level risk, and the emergency message can be sent to a selected contact depending upon the severity of the risk score.Type: ApplicationFiled: November 17, 2017Publication date: May 23, 2019Inventors: Steven A. Cordes, Michael S. Gordon, Nigel Hinds, Maja Vukovic
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Publication number: 20190156191Abstract: A mobile electronic device such as a smartphone is used in conjunction with a deep learning system to detect and respond to personal danger. The deep learning system monitors current information (such as location, audio, biometrics, etc.) from the smartphone and generates a risk score by comparing the information to a routine profile for the user. If the risk score exceeds a predetermined threshold, an alert is sent to the smartphone which presents an alert screen to the user. The alert screen allows the user to cancel the alert (and notify the deep learning system) or confirm the alert (and immediately transmit an emergency message). Multiple emergency contacts can be designated, e.g., one for a low-level risk, another for an intermediate-level risk, and another for a high-level risk, and the emergency message can be sent to a selected contact depending upon the severity of the risk score.Type: ApplicationFiled: November 17, 2017Publication date: May 23, 2019Inventors: Steven A. Cordes, Michael S. Gordon, Nigel Hinds, Maja Vukovic
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Patent number: 10288645Abstract: An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.Type: GrantFiled: June 30, 2015Date of Patent: May 14, 2019Assignee: GLOBALFOUNDRIES INC.Inventors: David M. Audette, Sukjay J. Chey, Steven A. Cordes, Anthony D. Fortin, David L. Gardell, John R. Maher, Sankeerth Rajalingam, Frederick H. Roy, III
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Patent number: 10168478Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.Type: GrantFiled: March 23, 2017Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Aydin Babakhani, Steven A. Cordes, Jean-Olivier Plouchart, Scott K. Reynolds, Peter J. Sorce, Robert E. Trzcinski
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Patent number: 10168477Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.Type: GrantFiled: November 17, 2016Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Aydin Babakhani, Steven A. Cordes, Jean-Olivier Plouchart, Scott K. Reynolds, Peter J. Sorce, Robert E. Trzcinski
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Publication number: 20180189411Abstract: Resolving a query received from a first node in a network includes accepting, by a second node in the network, ownership of the query from the first node, receiving, at the second node, an identification of a third node in the network, wherein the identification is received from a user of the second node and the user of the second node believes that a user of the third node has information necessary to resolve at least part of the query, and transferring, by the second node, ownership of the at least part of the query to the third node, wherein the accepting, the receiving, and the transferring dynamically generates a data structure that traces a propagation of the query, and the data structure is accessible to an origin of the query.Type: ApplicationFiled: March 1, 2018Publication date: July 5, 2018Inventors: Steven A. Cordes, Debra C. Leach, Debra A. Loussedes, Patrick R. Varekamp
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Patent number: 9953090Abstract: Resolving a query received from a first node in a network includes accepting, by a second node in the network, ownership of the query from the first node, receiving, at the second node, an identification of a third node in the network, wherein the identification is received from a user of the second node and the user of the second node believes that a user of the third node has information necessary to resolve at least part of the query, and transferring, by the second node, ownership of the at least part of the query to the third node, wherein the accepting, the receiving, and the transferring dynamically generates a data structure that traces a propagation of the query, and the data structure is accessible to an origin of the query.Type: GrantFiled: May 3, 2017Date of Patent: April 24, 2018Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Debra C. Leach, Debra A. Loussedes, Patrick R. Varekamp
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Patent number: 9872394Abstract: A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.Type: GrantFiled: April 5, 2016Date of Patent: January 16, 2018Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Bing Dang, Sung K. Kang, Yu Luo, Peter J. Sorce
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Publication number: 20170235843Abstract: Resolving a query received from a first node in a network includes accepting, by a second node in the network, ownership of the query from the first node, receiving, at the second node, an identification of a third node in the network, wherein the identification is received from a user of the second node and the user of the second node believes that a user of the third node has information necessary to resolve at least part of the query, and transferring, by the second node, ownership of the at least part of the query to the third node, wherein the accepting, the receiving, and the transferring dynamically generates a data structure that traces a propagation of the query, and the data structure is accessible to an origin of the query.Type: ApplicationFiled: May 3, 2017Publication date: August 17, 2017Inventors: Steven A. Cordes, Debra C. Leach, Debra A. Loussedes, Patrick R. Varekamp
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Publication number: 20170192172Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.Type: ApplicationFiled: March 23, 2017Publication date: July 6, 2017Inventors: Aydin Babakhani, Steven A. Cordes, Jean-Olivier Plouchart, Scott K. Reynolds, Peter J. Sorce, Robert E. Trzcinski
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Patent number: 9679023Abstract: Resolving a query received from a first node in a network includes accepting, by a second node in the network, ownership of the query from the first node, receiving, at the second node, an identification of a third node in the network, wherein the identification is received from a user of the second node and the user of the second node believes that a user of the third node has information necessary to resolve at least part of the query, and transferring, by the second node, ownership of the at least part of the query to the third node, wherein the accepting, the receiving, and the transferring dynamically generates a data structure that traces a propagation of the query, and the data structure is accessible to an origin of the query.Type: GrantFiled: December 22, 2015Date of Patent: June 13, 2017Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Debra C. Leach, Debra A. Loussedes, Patrick R. Varekamp
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Patent number: 9632251Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.Type: GrantFiled: April 2, 2014Date of Patent: April 25, 2017Assignee: International Business Machines CorporationInventors: Aydin Babakhani, Steven A. Cordes, Jean-Olivier Plouchart, Scott K. Reynolds, Peter J. Sorce, Robert E. Trzcinski
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Publication number: 20170068050Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.Type: ApplicationFiled: November 17, 2016Publication date: March 9, 2017Inventors: Aydin Babakhani, Steven A. Cordes, Jean-Olivier Plouchart, Scott K. Reynolds, Peter J. Sorce, Robert E. Trzcinski
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Publication number: 20170003318Abstract: An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate.Type: ApplicationFiled: June 30, 2015Publication date: January 5, 2017Inventors: David M. AUDETTE, Sukjay J. CHEY, Steven A. CORDES, Anthony D. FORTIN, David L. GARDELL, John R. MAHER, III, Sankeerth RAJALINGAM, Frederick H. ROY, III
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Patent number: 9433101Abstract: A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.Type: GrantFiled: October 16, 2014Date of Patent: August 30, 2016Assignee: International Business Machines CorporationInventors: Steven A. Cordes, Bing Dang, Sung K. Kang, Yu Luo, Peter J. Sorce
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Publication number: 20160219715Abstract: A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.Type: ApplicationFiled: April 5, 2016Publication date: July 28, 2016Inventors: Steven A. Cordes, Bing Dang, Sung K. Kang, Yu Luo, Peter J. Sorce