Abstract: Ferroelectric switching properties are severely degraded in a hydrogen ambient atmosphere. By controlling the polarity of the capacitors in a ferroelectric memory during the manufacturing process, the amount of degradation can be significantly reduced. After metalization of a ferroelectric memory wafer, all of the ferroelectric capacitors are poled in the same direction. The polarization vector is in a direction that helps to counteract hydrogen damage. A hydrogen gas anneal is subsequently performed to control underlying CMOS structures while maintaining ferroelectric electrical properties. The wafer is then passivated and tested.

Abstract: A reference cell for a 1T/1C ferroelectric memory includes a transistor of a first polarity type having a gate coupled to a reference cell word line, and a current path coupled between a bit line and an internal reference cell node, a transistor of a second polarity type having a gate coupled to a pre-charge line, and a current path coupled between a source of supply voltage and the internal reference cell node, and a ferroelectric capacitor coupled between the internal reference cell node and ground.

Abstract: A circuit and method for reducing compensation of a ferroelectric capacitor in a cell of a memory array allows the capacitor's hysteresis loop to be repositioned toward its uncompensated position by pulsing the electrodes of the memory cell capacitors, via the memory array plate line, one or more additional times whenever a "write" occurs to the memory array. As a result, the ferroelectric capacitor delivers a signal of greater strength to the memory device sense amps upon a subsequent "read" operation significantly enhancing overall reliability and yield yet without reducing overall device endurance.

Abstract: A circuit and method for reducing compensation of a ferroelectric capacitor in a cell of a memory array allows the capacitor's hysteresis loop to be repositioned toward its uncompensated position by pulsing the electrodes of the memory cell capacitors, via the memory array plate line, one or more additional times whenever a "write" occurs to the memory array. As a result, the ferroelectric capacitor delivers a signal of greater strength to the memory device sense amps upon a subsequent "read" operation significantly enhancing overall reliability and yield yet without reducing overall device endurance.

Abstract: A method for passivating an integrated circuit includes the RF sputtering of a hard passivation layer on the surface of the integrated circuit. The hard passivation layer can be a ceramic material such as various doped and undoped titanates, zirconates, niobates, tantalates, stanates, hafnates, and manganates, in either their ferroelectric or non-ferroelectric phases. Other exotic, hard, and usually non-ferroelectric materials not normally found in integrated circuit processing such as carbides may also be used. If the integrated circuit sought to be passivated contains ferroelectric devices, the hard passivation layer can be fabricated out of the same material used in the integrated ferroelectric devices. An optional silicon dioxide insulating layer can be deposited on the surface of the integrated circuit before the hard passivation layer is deposited. The optional silicon dioxide layer is used to prevent any possible contamination of the integrated circuit by the passivation layer.

Abstract: A method for passivating an integrated circuit includes the RF sputtering of a hard passivation layer on the surface of the integrated circuit. The hard passivation layer can be a ceramic material such as various doped and undoped titanates, zirconates, niobates, tantalates, stanates, hafnates, and manganates, in either their ferroelectric or non-ferroelectric phases. Other exotic, hard, and usually non-ferroelectric materials not normally found in integrated circuit processing such as carbides may also be used. If the integrated circuit sought to be passivated contains ferroelectric devices, the hard passivation layer can be fabricated out of the same material used in the integrated ferroelectric devices. An optional silicon dioxide insulating layer can be deposited on the surface of the integrated circuit before the hard passivation layer is deposited. The optional silicon dioxide layer is used to prevent any possible contamination of the integrated circuit by the passivation layer.