Abstract: Electron beam position, size, or shape can be estimated by deflecting the beam to a plurality of apertures, either continuously or step-wise. Beam portions transmitted, absorbed, or scattered can be used to assess position, size, and shape. In other examples, a beam sensing aperture and the beam are oscillated with respect to each other by moving the aperture or varying the beam deflection or both. The beam can be directed to segmented detectors such as a quad detector, and currents in the segments used to assess beam position, shape, or size. The segments can be formed from a single conductive sheet on which the segments are defined but remain attached. After the conductive sheet is secured with an insulative adhesive, portions of the conductive sheet are broken away, leaving aligned segments.

Abstract: A position encoder for monitoring position of an object includes a target pattern, an illumination system, an image sensor, and a control system. The illumination system generates (i) a first illumination beam that is directed toward and impinges on the target pattern, the first illumination beam having a first beam characteristic; and (ii) a second illumination beam that is directed toward and impinges on the target pattern, the second illumination beam having a second beam characteristic that is different than the first beam characteristic. The image sensor is coupled to the object and is spaced apart from the target pattern. The image sensor senses a first set of information from the first illumination beam impinging on the target pattern and senses a second set of information from the second illumination beam impinging on the target pattern. The control system analyzes the first set of information and the second set of information to monitor the position of the object.

Abstract: Alignment patterns that are selected based on device pattern spatial frequencies are defined on a reticle. The alignment patterns can include periodic arrays of lines, spaces, dots, of other pattern elements. Such patterns can be defined as sets associated with a common spatial frequency or frequency range, or some or all sets can include alignment marks having mark elements associated with different spatial frequencies.

Abstract: A position encoder for monitoring position of an object includes a target pattern, an illumination system, an image sensor, and a control system. The illumination system generates (i) a first illumination beam that is directed toward and impinges on the target pattern, the first illumination beam having a first beam characteristic; and (ii) a second illumination beam that is directed toward and impinges on the target pattern, the second illumination beam having a second beam characteristic that is different than the first beam characteristic. The image sensor is coupled to the object and is spaced apart from the target pattern. The image sensor senses a first set of information from the first illumination beam impinging on the target pattern and senses a second set of information from the second illumination beam impinging on the target pattern. The control system analyzes the first set of information and the second set of information to monitor the position of the object.

Abstract: Alignment patterns that are selected based on device pattern spatial frequencies are defined on a reticle. The alignment patterns can include periodic arrays of lines, spaces, dots, of other pattern elements. Such patterns can be defined as sets associated with a common spatial frequency or frequency range, or some or all sets can include alignment marks having mark elements associated with different spatial frequencies.

Abstract: A problem of automatic co-registration of multiple images, of the same scene, acquired through multispectral imaging channel(s) (including but not limited to IR, NIR, visible light channels) and polarized imaging in real time is solved by combining into a single eyewear device imaging cameras each configured to acquire imaging through a specific channel. Images from all cameras are simultaneously processed in real-time to deliver overlapping (and accurately registered) composite images, which are displayed to a viewing screen on the inside of the eyewear device.

Abstract: An imaging assembly for directing a pattern of energy at a workpiece includes (i) a reticle that defines a reticle array that includes a plurality of spaced apart, transmitting regions; (ii) an illumination source that generates an illumination beam; and (iii) a director assembly that selectively directs the illumination beam at the reticle array, the director assembly includes a plurality of director elements that are individually controlled to selectively control the beam pattern that is directed at the reticle array.

Abstract: An imaging assembly for directing a pattern of energy at a workpiece includes (i) a reticle that defines a reticle array that includes a plurality of spaced apart, transmitting regions; (ii) an illumination source that generates an illumination beam; and (iii) a director assembly that selectively directs the illumination beam at the reticle array, the director assembly includes a plurality of director elements that are individually controlled to selectively control the beam pattern that is directed at the reticle array.

Abstract: A method for matching a first OPE curve (700) for a first exposure apparatus (10A) used to transfer an image to a wafer (28) to a second OPE curve (702) of a second exposure apparatus (10B). The method can include the step of adjusting a tilt of a wafer stage (50) that retains the wafer to adjust the first OPE curve. As provided herein, the first exposure apparatus (10A) has the first OPE curve (700) because of the design of the components used in the first exposure apparatus (10A), and the second exposure apparatus (10B) has a second OPE curve (702) because of the design of the components used in the second exposure apparatus (10B). Further, the tilt of the wafer stage (50) can be selectively adjusted until the first OPE curve (700) approximately matches the second OPE curve (702). With this design, the two exposure apparatuses (10A) (10B) can be used for the same lithographic process.

Abstract: A system and method of calculating estimated image profiles. The system and method includes providing lens characteristic data and performing simulation calculations for various levels of aberration components using the lens characteristic data. A response surface functional relation is built between selected variables of the lens characteristics, in particular the lens aberration components, and the Image Profile using the simulation calculations. Evaluation is then performed on the arbitrary specified aberration values of a lens in relation to the response surface functional relations to provide a calculated estimate of the Image Profile for the specified aberration values. A machine readable medium and exposure apparatus are also provided.

Abstract: A method for matching a first OPE curve (700) for a first exposure apparatus (10A) used to transfer an image to a wafer (28) to a second OPE curve (702) of a second exposure apparatus (10B). The method can include the step of adjusting a tilt of a wafer stage (50) that retains the wafer to adjust the first OPE curve. As provided herein, the first exposure apparatus (10A) has the first OPE curve (700) because of the design of the components used in the first exposure apparatus (10A), and the second exposure apparatus (10B) has a second OPE curve (702) because of the design of the components used in the second exposure apparatus (10B). Further, the tilt of the wafer stage (50) can be selectively adjusted until the first OPE curve (700) approximately matches the second OPE curve (702). With this design, the two exposure apparatuses (10A) (10B) can be used for the same lithographic process.

Abstract: The layer of photoresist on a substrate to be exposed is deformed to approximate the shape of the region of best focus of the image to be projected thereon. The region of best focus is projected into a central region of the resist throughout the exposure field of the image. The deformation is accomplished by conforming the substrate with vacuum to a smoothly curved or spherically curved, permanent, rigid surface in a substrate chuck holding the substrate. The substrate chuck is mounted for motion on a substrate stage so that multiple exposure fields may be formed in the resist.