Abstract: Apparatus (10) for handling devices for testing under varying temperature conditions is disclosed including a mechanical arm (32) pivotally mounted by a bearing (34) to a control portion (16) which is variably vertically positionable relative to a platform portion (14). An insert arm (38) is rotatably mounted within the mechanical arm (32) to reciprocally and rotatably mount a thermal socket (90) for mating with a contactor (126). The socket (90) is mounted to a vacuum cup (48) to allow position alignment as alignment pins (132) are initially slideably received in alignment notches (124) and when no vacuum is applied and is fixed in the aligned position after the application of vacuum. Thermal tubes (74) of probes (50) are reciprocal with the thermal socket (90) to provide thermally conditioned gas/air to the thermal socket (90). The thermal socket (90) provides a swirling action to the thermally conditioned gas/air to exit 360.degree.

Abstract: Apparatus (10) for handling devices for testing under varying temperature conditions is disclosed including a mechanical arm (32) pivotally mounted by a bearing (34) to a control portion (16) which is variably vertically positionable relative to a platform portion (14). An insert arm (38) is rotatably mounted within the mechanical arm (32) to reciprocally and rotatably mount a thermal socket (90) for mating with a contactor (126). The socket (90) is mounted to a vacuum cup (48) to allow position alignment as alignment pins (132) are initially slideably received in alignment notches (124) and when no vacuum is applied and is fixed in the aligned position after the application of vacuum. Thermal tubes (74) of probes (50) are reciprocal with the thermal socket (90) to provide thermally conditioned gas/air to the thermal socket (90). The thermal socket (90) provides a swirling action to the thermally conditioned gas/air to exit 360.degree.