Abstract: In accordance with the embodiments described herein, there is provided an enclosure system including an enclosure formed of an insulating material, and at least one heatsink arrangement formed of a thermally-conductive material. The heatsink arrangement includes a heat conductive surface configured as one of a pyramid, an inverted pyramid, a plateau, a spherical segment, and an inverted spherical segment. The heatsink arrangement in the enclosure system can be integrally formed from the enclosure such that a demarcation between the heatsink arrangement and the enclosure is water-tight. The enclosure and the heatsink arrangement can also be simultaneously integrally formed and enmeshed using additive manufacturing processes.

Abstract: In accordance with the embodiments described herein, there is provided an enclosure system including an enclosure formed of an insulating material, and at least one heatsink arrangement formed of a thermally-conductive material. The heatsink arrangement includes at heat conductive surface configured as one of a pyramid, an inverted pyramid, a plateau, a spherical segment, and an inverted spherical segment. The heatsink arrangement in the enclosure system can be integrally formed from the enclosure such that a demarcation between the heatsink arrangement and the enclosure is water-tight. The enclosure and the heatsink arrangement can also be simultaneously integrally formed and enmeshed using additive manufacturing processes.

Abstract: In accordance with the embodiments described herein, there is provided an enclosure system including an enclosure formed of an insulating material, and at least one heatsink arrangement formed of a thermally-conductive material. The heatsink arrangement includes at heat conductive surface configured as one of a pyramid, an inverted pyramid, a plateau, a spherical segment, and an inverted spherical segment. The heatsink arrangement in the enclosure system can be integrally formed from the enclosure such that a demarcation between the heatsink arrangement and the enclosure is water-tight. The enclosure and the heatsink arrangement can also be simultaneously integrally formed and enmeshed using additive manufacturing processes.

Abstract: In accordance with the embodiments described herein, there is provided an enclosure system including an enclosure formed of an insulating material, and at least one heatsink arrangement formed of a thermally-conductive material. The heatsink arrangement includes at heat conductive surface configured as one of a pyramid, an inverted pyramid, a plateau, a spherical segment, and an inverted spherical segment. The heatsink arrangement in the enclosure system can be integrally formed from the enclosure such that a demarcation between the heatsink arrangement and the enclosure is water-tight. The enclosure and the heatsink arrangement can also be simultaneously integrally formed and enmeshed using additive manufacturing processes.

Abstract: A method of deinterleaving parameter descriptor word (PDW) data includes parallel scoring of pulses in an a posteriori search for associating of pulses based on proximity within a multi-parameter problem space. The a posteriori search includes scoring an oldest pulse against all newer pulses, and then scoring a next oldest pulse against all newer pulses. The associating utilizes at least one of a plurality of parallel computation modes, parallel tasks to operate on separate data fields, and multi-threading or multitasking that can implement one of parallel and configuration-overlaid operation, synchronized by events.