Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: An illuminated sign includes a plurality of sections. Each section includes a mesh of conductors having illuminating pixels located at conductor intersections. The mesh is surrounded by a frame connected to the frame of another section. Once frame sections of the display are unfolded, the display can be supported by a structure attached to a car or other vehicle. A support structure for an illuminated display includes a base which is placed on the ground and over which the tire of a vehicle (e.g., a police car) is parked. A column extends from the base, and a display can be attached to the top of that extending column.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.