Patents by Inventor Steven G. Gebauer

Steven G. Gebauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964617
    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
    Type: Grant
    Filed: July 6, 2023
    Date of Patent: April 23, 2024
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Publication number: 20230339412
    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
    Type: Application
    Filed: July 6, 2023
    Publication date: October 26, 2023
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Publication number: 20230219500
    Abstract: A vehicular camera module includes a housing for mounting at a vehicular windshield, a processor printed circuit board (processor PCB) disposed in the housing, and an imager assembly. The imager assembly includes (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board (imager PCB), and (iii) a flexible electrical ribbon cable that electrically connects the imager PCB to the processor PCB. An imager is disposed at a first side of the imager PCB. The imager PCB includes an imager portion at which the imager is disposed and attaching portions at respective outboard ends. At least one stress relieving portion is established at the imager PCB between the imager portion and each of the attaching portions. With the lens barrel received through an aperture of the housing, the attaching portions of the imager PCB are attached at the housing via respective fasteners.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 13, 2023
    Inventors: Garret F. Achenbach, Martin J. Reckker, Steven G. Gebauer, Jianguo Wang
  • Patent number: 11697382
    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: July 11, 2023
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Publication number: 20220355745
    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 10, 2022
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Patent number: 11390223
    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB and includes an image processing chip. Image data captured by the imager is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: July 19, 2022
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Publication number: 20210188191
    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB and includes an image processing chip. Image data captured by the imager is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion.
    Type: Application
    Filed: March 10, 2021
    Publication date: June 24, 2021
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Patent number: 10946813
    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens barrel. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. A flexible cable electrically connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion to enhance heat transfer from the electronic component to the lower housing portion.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: March 16, 2021
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Publication number: 20200198550
    Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens barrel. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. A flexible cable electrically connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion to enhance heat transfer from the electronic component to the lower housing portion.
    Type: Application
    Filed: March 2, 2020
    Publication date: June 25, 2020
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Patent number: 10576908
    Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: March 3, 2020
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Publication number: 20190184911
    Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.
    Type: Application
    Filed: February 25, 2019
    Publication date: June 20, 2019
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Patent number: 10214157
    Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: February 26, 2019
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Publication number: 20180170279
    Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.
    Type: Application
    Filed: February 19, 2018
    Publication date: June 21, 2018
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Patent number: 9896039
    Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: February 20, 2018
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer
  • Publication number: 20150327398
    Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.
    Type: Application
    Filed: May 6, 2015
    Publication date: November 12, 2015
    Inventors: Garret F. Achenbach, Brian A. Gorman, Brian F. Smith, Steven G. Gebauer