Patents by Inventor Steven Grabey
Steven Grabey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10074456Abstract: A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d50) of the glass composition is no more than about 5 ?m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.Type: GrantFiled: May 29, 2015Date of Patent: September 11, 2018Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Matthew Sgriccia, Mark Challingsworth, Samson Shahbazi, Ryan Persons, Steven Grabey
-
Patent number: 10039180Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.Type: GrantFiled: April 5, 2016Date of Patent: July 31, 2018Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Steven Grabey, Mark Challingsworth, Ryan Persons
-
Patent number: 9986650Abstract: A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.Type: GrantFiled: October 30, 2014Date of Patent: May 29, 2018Assignee: Heracus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Steven Grabey
-
Patent number: 9892816Abstract: An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of Al2O3, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.Type: GrantFiled: May 5, 2014Date of Patent: February 13, 2018Assignee: Heraeus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Steven Grabey, Mark Challingsworth
-
Publication number: 20170303387Abstract: A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.Type: ApplicationFiled: April 5, 2016Publication date: October 19, 2017Inventors: Samson SHAHBAZI, Steven GRABEY, Mark CHALLINGSWORTH, Ryan PERSONS
-
Publication number: 20150348672Abstract: A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d50) of the glass composition is no more than about 5 ?m, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.Type: ApplicationFiled: May 29, 2015Publication date: December 3, 2015Inventors: Matthew SGRICCIA, Mark Challingsworth, Samson Shahbazi, Ryan Persons, Steven Grabey
-
Publication number: 20150257279Abstract: A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.Type: ApplicationFiled: October 30, 2014Publication date: September 10, 2015Inventors: Samson Shahbazi, Steven Grabey
-
Publication number: 20150231740Abstract: A method of soldering to a polymer thick film material, comprising the steps of providing a substrate having a polymer thick film layer on at least one surface of the substrate, incorporating a metal preform into the polymer thick film layer such that a surface of the metal preform is exposed, curing the polymer thick film layer to secure the metal preform thereto, and soldering to the exposed surface of the metal preform using a solder material.Type: ApplicationFiled: February 9, 2015Publication date: August 20, 2015Inventors: Steven Grabey, Sarah Groman, Ryan Persons, Samson Shahbazi
-
Publication number: 20150004359Abstract: An electroconductive hole plug paste comprising about 60-80 wt % of platinum particles, about 10-20 wt % of Al2O3, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.Type: ApplicationFiled: May 5, 2014Publication date: January 1, 2015Applicant: Heraeus Precious Metals North America Conshohocken LLPInventors: Samson Shahbazi, Steven Grabey, Mark Challingsworth
-
Publication number: 20140224417Abstract: A sealing glass composition including about 30-95 wt % glass or ceramic particles, and about 1-50 wt % organic vehicle, wherein the organic vehicle comprises an acrylic resin component and a solvent, based upon 100% total weight of the sealing glass composition, wherein the composition has a viscosity of at least about 200 kcPs and no more than about 1450 kcPs, is provided. A method of applying a sealing glass composition to a substrate comprising the steps of providing a metal substrate, providing a supporting sheet having a front surface coated with a releasing agent, depositing a sealing glass composition onto the front surface of the releasable sheet, drying the sealing glass composition to form a sealing glass composition decal, removing the sealing glass composition decal from the front surface of the supporting sheet, and placing the dried sealing glass composition decal onto a metal substrate, is provided.Type: ApplicationFiled: February 7, 2014Publication date: August 14, 2014Applicant: Heraeus Precious Metals North America Conshohocken LLCInventors: Samson Shahbazi, Steven Grabey, Mark Challingsworth