Abstract: The present disclosure relates to novel methods for preparing rapamycin analog compounds, as well as to related intermediates useful in such methods.

Abstract: A parallelized chain-synthesizing technique includes capillary tubes, where each tube provides multiple locations or addresses where a specific arbitrary sequence for polymeric chains can be synthesized. An optical addressing system selectively delivers light to the locations to mediate or control reactions in the tubes.

Abstract: Techniques for evaluating images are disclosed. An image is displayed. Data corresponding to a gaze fixation of a user who is viewing the image is obtained. An image artifact is identified based on the gaze fixation. The image artifact is at a location in the image where the gaze fixation occurred. A recording of the user's utterance is accessed. This recording is recorded during an overlapping time period with when the gaze fixation occurred. The recording is transcribed into text, which is then parsed. A key term is extracted from the parsed text. A determination is made as to whether the key term corresponds to the image artifact identified based on the gaze fixation.

Abstract: An exercise machine with a more natural gait and computer gaming interface which, in some embodiments, further allows for a variable stride length while in use. In one configuration, each side of the exercise machine has a first crank assembly connected at an upper location on a pedal arm and a second crank connected at a middle location on the pedal arm, and a pedal is attached to a lower location of the pedal arm. The first crank assembly is connected to the pedal arm by a crank arm. The second crank assembly is connected to the pedal arm via a crank arm pivotally attached to a crank link. The path of each pedal is determined by the lengths of crank arms and crank links of the first and second crank assemblies rotating in synchronous motion.

Abstract: A display may be formed by an array of light-emitting diodes mounted to the surface of a display substrate. The light-emitting diodes may be inorganic light-emitting diodes formed from separate crystalline semiconductor structures. An array of pixel control circuits may be used to control light emission from the light-emitting diodes. Each pixel control circuit may be configured to control one or more respective passive matrices. To control partial pixel cells in the display, a donor pixel control circuit in a partial pixel cell may control the pixels in a receptor partial pixel cell without a pixel control circuit. To mitigate the size of an inactive area of the display, fanout signal lines for the display may be formed in the light-emitting active area of the display. The fanout signal lines may be formed between a row of pixel control circuits and a bottom edge of the light-emitting active area.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A glass touch screen protector for a portable electronic device having a front face including a touch screen portion and an outer perimeter. The touch screen protector can include a glass sheet having front and back sides, an outer perimeter that corresponds to that of the device, and a transparent window portion; and a spacer provided along the outer perimeter of the glass sheet surrounding the transparent window portion, having a thickness sufficient to space the glass sheet near but not in contact with the touch screen portion, and an exposed adhesive for removably mounting the protector upon the outer perimeter of the front face to form an enclosed air space between the transparent window portion of the plastic film, the spacer and the touch screen portion of the device. The glass sheet can be convex in shape with respect to the touch screen portion of the portable electronic device.

Abstract: A transportable jack system includes a jack disposed on a base. The base includes a base plate with a plurality of wheel openings formed therein, and a biasing member disposed between a wheel and the base plate. The biasing member is configured from a single piece of material consisting of a top horizontal portion, a bottom horizontal portion, and an angled middle portion disposed between the top horizontal portion and the bottom horizontal portion. The biasing member biases the base away from a ground surface when a load applied to the jack is below a predetermined threshold and deforms when the load is above the predetermined threshold, wherein the deformation allows the base plate to contact the ground surface.

Abstract: A transportable jack system includes a jack disposed on a base. The base includes a base plate with a plurality of wheel openings formed therein, and a biasing member disposed between a wheel and the base plate. The biasing member is configured from a single piece of material consisting of a top horizontal portion, a bottom horizontal portion, and an angled middle portion disposed between the top horizontal portion and the bottom horizontal portion. The biasing member biases the base away from a ground surface when a load applied to the jack is below a predetermined threshold and deforms when the load is above the predetermined threshold, wherein the deformation allows the base plate to contact the ground surface.

Abstract: The invention relates to a touch screen protector for a hand held electronic device having a front face that includes a touch screen portion and a non-functional band. The touch screen protector of the invention comprises a plastic film having front and back sides, an outer perimeter that corresponds to that of the device, and a transparent window; a spacer provided along the outer perimeter of the plastic film surrounding the transparent window, having a thickness sufficient to space the plastic film near but not in contact with the touch screen portion; an exposed adhesive for removably mounting the protector upon the outer perimeter of the front face to form an enclosed air space between the transparent window of the plastic film, the spacer and the touch screen portion of the device; and a joining adhesive for adhering the spacer to the back side of the plastic film.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: Embodiments of vehicle lifts and swivel mounts are disclosed. A lifting system for a vehicle comprises a vehicle lift and a mount configured to attach to the vehicle lift. The mount has a saddle comprising a horizontal plate and first and second side plates extending from opposing sides of the horizontal plate; a pair of raceways disposed atop the horizontal plate defining a channel; a plurality of ball bearings disposed within the channel; a tray rotatably secured to the horizontal plate, the tray being freely rotatable atop the ball bearings; and at least one tie down secured to the saddle. A vehicle is positioned atop the mount and is rotatable via the tray. Rotation of the vehicle is temporarily impeded by strapping the vehicle to the tie down.

Abstract: Disclosed herein are novel charge mode readout circuits and associated methods of signal processing. The devices and methods of the invention allow for the improved processing of stored signals by a charge mode readout amplifier, wherein the readout level may be shifted to a desired range and wherein a fully differential output swing may be imparted. The invention advantageously employs a single pair of capacitors to serve the dual roles of modulating amplifier gain and level shifting the output.

Abstract: Ping-pong readout architecture allows for faster frame rates in CMOS image sensors. However, various problems are created by this architecture due to cross-talk between components. Provided herein are novel ping-pong readout layouts which better isolate components to reduce crosstalk issues. Also provided herein are novel timing schemes for operating ping-pong readout circuits which prevent crosstalk signal spikes or readout corruption.

Abstract: A stitched image sensor array on a semiconductor substrate with identical blocks that have wherein said first configuration includes enable inputs, which vary a function of the block depending on the connection to the enable inputs. The enable inputs can set an SRAM to receive different numbers of inputs.