Abstract: A hinge area and processes of forming the hinge area are described. The hinge area is part of cover of a laptop computer. A material used for the cover is of a certain thickness. Stamping and forming a shape that defines the hinge area is performed on the material. The top of the shape is cut to provide for sides of the hinge area. Squeeze forging operations are performed to thicken the sides, and CNC machining is further performed on the sides.

Abstract: A hinge area and processes of forming the hinge area are described. The hinge area is part of cover of a laptop computer. A material used for the cover is of a certain thickness. Stamping and forming a shape that defines the hinge area is performed on the material. The top of the shape is cut to provide for sides of the hinge area. Squeeze forging operations are performed to thicken the sides, and CNC machining is further performed on the sides.

Abstract: A base chassis of an information handling system with a generally triangular profile is formed by connecting a plurality of three-dimensional sheet metal structural elements, wherein at least two of the elements have the same shape and a gusset. The gusset connects two of the structural elements. A plastic chassis assembly may be fitted over the base chassis. The plastic chassis assembly formed to received side door covers on the base chassis.

Abstract: A base chassis of an information handling system with a generally triangular profile is formed by connecting a plurality of three-dimensional sheet metal structural elements, wherein at least two of the elements have the same shape and a gusset. The gusset connects two of the structural elements. A plastic chassis assembly may be fitted over the base chassis. The plastic chassis assembly formed to received side door covers on the base chassis.

Abstract: A base chassis of an information handling system with a generally triangular profile is formed by connecting a plurality of three-dimensional sheet metal structural elements, wherein at least two of the elements have the same shape and a gusset. The gusset connects two of the structural elements. A plastic chassis assembly may be fitted over the base chassis. One or more handles may also be fitted over the base chassis. They may be located at vertices of the base chassis. Side door covers may be secured by rims on the base chassis.

Abstract: A base chassis of an information handling system with a generally triangular profile is formed by connecting a plurality of three-dimensional sheet metal structural elements, wherein at least two of the elements have the same shape and a gusset. The gusset connects two of the structural elements. A plastic chassis assembly may be fitted over the base chassis. One or more handles may also be fitted over the base chassis. They may be located at vertices of the base chassis. Side door covers may be secured by rims on the base chassis.

Abstract: An assembly includes an enclosure and a guide rail. The enclosure includes first and second top portions, first and second side portions, and a bottom portion, and is a single piece of material such that the first top portion, the first side portion, the bottom portion, the second side portion, and the second top portion are continuous portions of the single piece of material. The guide rail is attached to the first and second top portions of the enclosure, to join the first and second top portions together, and to align the assembly within a server rack chassis.

Abstract: An assembly includes an enclosure and a guide rail. The enclosure includes first and second top portions, first and second side portions, and a bottom portion, and is a single piece of material such that the first top portion, the first side portion, the bottom portion, the second side portion, and the second top portion are continuous portions of the single piece of material. The guide rail is attached to the first and second top portions of the enclosure, to join the first and second top portions together, and to align the assembly within a server rack chassis.

Abstract: A peripheral device assembly is disclosed wherein the assembly includes a device bay for receiving a peripheral device carrier. An interior side surface of the device bay defines at least one extrusion portion surrounding a hole for receiving a first end of a lever arm of the peripheral device carrier, and the extrusion portion comprises edges protruding from the interior side surface of the device bay toward an exterior side surface of the device bay.

Abstract: A peripheral card EMI shielding scheme which comprises a sandwich of three layers. The first layer comprises a chassis rear wall (e.g., constructed of sheet metal). The next layer, which in certain embodiments is the middle of the sandwich, comprises a relatively thin plate (e.g., 0.15 mm+/?0.1 mm) with spring arms. The third layer comprises a sheet metal plate (in certain embodiments, the third layer has a similar thickness to the rear wall). The thick sheet metal plate completely covers the thin plate, except for areas where the spring arms protrude. The three plates are staked together by a method similar to an extrude-and-roll process (e.g., where one piece is fastened to another without the need for additional hardware or welding).

Abstract: A peripheral card EMI shielding scheme which comprises a sandwich of three layers. The first layer comprises a chassis rear wall (e.g., constructed of sheet metal). The next layer, which in certain embodiments is the middle of the sandwich, comprises a relatively thin plate (e.g., 0.15 mm+/?0.1 mm) with spring arms. The third layer comprises a sheet metal plate (in certain embodiments, the third layer has a similar thickness to the rear wall). The thick sheet metal plate completely covers the thin plate, except for areas where the spring arms protrude. The three plates are staked together by a method similar to an extrude-and-roll process (e.g., where one piece is fastened to another without the need for additional hardware or welding).

Abstract: Apparatus and methods for assembling together separate components, such as a first substantially flat sheet metal component to a second substantially flat sheet metal component, in substantially perpendicular relationship. A first latch component body may have an elongated displaceable latch member provided on a first edge of the first latch component body that is configured to be received and latchably retained within a latch reception opening of a second latch component body that is of complementary shape and dimensions to receive the displaceable latch member.

Abstract: A peripheral device assembly is disclosed wherein the assembly includes a device bay for receiving a peripheral device carrier. An interior side surface of the device bay defines at least one extrusion portion surrounding a hole for receiving a first end of a lever arm of the peripheral device carrier, and the extrusion portion comprises edges protruding from the interior side surface of the device bay toward an exterior side surface of the device bay.

Abstract: Apparatus and methods for assembling together separate components, such as a first substantially flat sheet metal component to a second substantially flat sheet metal component, in substantially perpendicular relationship. A first latch component body may have an elongated displaceable latch member provided on a first edge of the first latch component body that is configured to be received and latchably retained within a latch reception opening of a second latch component body that is of complementary shape and dimensions to receive the displaceable latch member.

Abstract: A chassis is disclosed that includes a sidewall having an aperture and a gasket connected to the sidewall. A portion of the gasket protrudes through the aperture into a bay. A carrier may couple with the chassis such that the gasket touches the carrier. The gasket may discharge electrostatic buildup of the carrier and/or exert force on the carrier, such that the carrier resists movement.

Abstract: A chassis having an alignment form is disclosed. The alignment form has dimples that permit a carrier to be aligned with the chassis sidewall. When a component is inserted in the computer system, the component contacts the dimples and aligns in the chassis sidewall.