Patents by Inventor Steven L. Hamren

Steven L. Hamren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020008532
    Abstract: The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures.
    Type: Application
    Filed: August 6, 2001
    Publication date: January 24, 2002
    Inventor: Steven L. Hamren
  • Publication number: 20020008531
    Abstract: The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasina force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures.
    Type: Application
    Filed: August 2, 2001
    Publication date: January 24, 2002
    Inventor: Steven L. Hamren
  • Publication number: 20020000817
    Abstract: The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures.
    Type: Application
    Filed: August 6, 2001
    Publication date: January 3, 2002
    Inventor: Steven L. Hamren
  • Publication number: 20010045838
    Abstract: The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures.
    Type: Application
    Filed: August 6, 2001
    Publication date: November 29, 2001
    Inventor: Steven L. Hamren
  • Publication number: 20010040463
    Abstract: The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures.
    Type: Application
    Filed: July 24, 2001
    Publication date: November 15, 2001
    Inventor: Steven L. Hamren
  • Patent number: 6307769
    Abstract: Disclosed are semiconductor devices having terminal arrangements in which mirrored pairs of the semiconductor devices can be tested by a common test device.
    Type: Grant
    Filed: September 2, 1999
    Date of Patent: October 23, 2001
    Assignee: Micron Technology, Inc.
    Inventors: James P. Nuxoll, Steven L. Hamren
  • Publication number: 20010026167
    Abstract: A compliant contactor interfaces a semiconductor device under test with a tester. The compliant contactor accepts a variety of different sized semiconductor devices along with a variety of different pinouts of the semiconductor devices. The compliant contactor includes an upper alignment block and a lower alignment block which receives the contact pins of the tester. The upper alignment block may move within a predefined distance with respect to the lower alignment block to account for any tester movement, thermal expansion or contraction, or other factors. In an alternative embodiment, the compliant contactor may move in three directions with respect to the test board. In this embodiment, a contact pad provides electrical connection between a daughter card and the test board. The contact pad may be a compressible elastomeric connector.
    Type: Application
    Filed: June 8, 2001
    Publication date: October 4, 2001
    Inventors: Justin L. Lawrence, Steven L. Hamren
  • Publication number: 20010024128
    Abstract: The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures.
    Type: Application
    Filed: May 24, 2001
    Publication date: September 27, 2001
    Inventor: Steven L. Hamren
  • Patent number: 6293817
    Abstract: An extended length, high frequency contactor block has a plurality of signal conductors, each having a contact element formed at its end. Each signal conductor has an inductance which is an inherent material property. The signal conductors are disposed within a plurality of layers configured to form a capacitor with each signal conductor. The plurality of layers is further configured to provide a capacitance which has a controlled relationship to the inductance of the signal conductors. The relationship may be controlled such that the impedance of each signal conductor is minimized. Because impedance is independent of length, the contactor block can be made to any length desired. A method of manufacturing a contactor block is also disclosed.
    Type: Grant
    Filed: August 4, 1999
    Date of Patent: September 25, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Steven L. Hamren, Justin L. Lawrence
  • Publication number: 20010022740
    Abstract: Disclosed are semiconductor devices having terminal arrangements in which mirrored pairs of the semiconductor devices can be tested by a common test device.
    Type: Application
    Filed: April 30, 2001
    Publication date: September 20, 2001
    Inventors: James P. Nuxoll, Steven L. Hamren
  • Patent number: 6265886
    Abstract: The present invention is directed toward conductive bump array contactors having an ejector and methods for testing bumped devices using such apparatus. In one aspect of the invention, an apparatus includes a base having a plurality of contact elements projecting therefrom, an ejector coupled to the base and moveable with respect to the base between a first position proximate the base and a second position spaced apart from the base, and an actuating device coupled to the base and to the ejector that asserts a force on the ejector. The biasing force is sufficient to overcome a sticking or attractive force that may develop between the conductive bumps and the contact elements. In one embodiment, the contact elements project into a single opening defined by the ejector. Alternately, the ejector includes a plurality of apertures, each contact element at least partially projecting into one of the apertures.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: July 24, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Steven L. Hamren
  • Patent number: 6259263
    Abstract: A compliant contactor interfaces a semiconductor device under test with a tester. The compliant contactor accepts a variety of different sized semiconductor devices along with a variety of different pinouts of the semiconductor devices. The compliant contactor includes an upper alignment block and a lower alignment block which receives the contact pins of the tester. The upper alignment block may move within a predefined distance with respect to the lower alignment block to account for any tester movement, thermal expansion or contraction, or other factors. In an alternative embodiment, the compliant contactor may move in three directions with respect to the test board. In this embodiment, a contact pad provides electrical connection between a daughter card and the test board. The contact pad may be a compressible elastomeric connector.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: July 10, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Justin L. Lawrence, Steven L. Hamren
  • Patent number: 5927503
    Abstract: An apparatus for processing an integrated circuit device comprises at least one insert having at least one beveled hole therein, the insert adapted to receive at least one semiconductor device. The apparatus further includes a tray having a pocket for receiving the insert and a slot, a deformable segment on the insert, and at least three posts on the insert. Further included is at least one tab on the deformable segment with one of the slots receiving the tab. The slot in the tray and the tab on the insert movably attaches the insert to the tray, the insert being self-aligning to a processing apparatus thereby in conjunction with the posts and allowing for removal of the insert from the pocket.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: July 27, 1999
    Assignee: Micron Technology, Inc.
    Inventors: Leland R. Nevill, William C. Layer, Steven L. Hamren, Gregory A. Barnett
  • Patent number: 5731230
    Abstract: An apparatus for processing an integrated circuit device comprises at least one insert having at least one beveled hole therein, the insert adapted to receive at least one semiconductor device. The apparatus further includes a tray having a pocket for receiving the insert and a slot, a deformable segment on the insert, and at least three posts on the insert. Further included is at least one tab on the deformable segment with one of the slots receiving the tab.
    Type: Grant
    Filed: October 24, 1996
    Date of Patent: March 24, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Leland R. Nevill, William C. Layer, Steven L. Hamren, Gregory A. Barnett