Abstract: Methods and systems for thermally managing data processing systems are disclosed. Data processing systems may provide computer implemented services to users thereof and/or other devices. The data processing systems may include various hardware components that perform computations used to provide the computer implemented services and may generate heat as a byproduct. To dissipate the heat generated by the hardware components, airflows proximate to the hardware components may be used to extract the heat. Once extracted, the heated airflows may be exhausted from the data processing systems. To facilitate use of the exhausted airflows, the airflows may be selectively directed in accordance with user preferences.

Abstract: A vehicle includes an air cleaner box assembly disposed within an engine compartment. The air cleaner box assembly includes a moveable shell portion and a stationary shell portion. The moveable shell portion includes an upper surface disposed adjacent a hood, and defines a filtered air chamber. The stationary shell portion is attached to a structure, and defines an unfiltered air chamber. A filter element is attached to and supported by the moveable shell portion. The filter element separates the filtered air chamber and the un-filtered air chamber. Each of a plurality of spring loaded guide members slideably connect the moveable shell portion and the stationary shell portion, and guide the moveable shell portion along a path relative to the stationary shell portion, between an expanded position and a compressed position.

Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.

Abstract: An aircraft air distribution system includes a base and first and second arrays of nozzle air transfer ports in the base. An adjustable flow plate is positioned over the nozzle air transfer ports. A compressible member is located between the base and the adjustable flow plate and between the first and second arrays. First and second air ejector regions are located, respectively, on the sides of the compressible member between the base and the adjustable flow plate to connect to the first and second arrays, and direct air from the first and second arrays from the sides of the base. Fasteners moveably connect the adjustable flow plate to the base and are adjustable to change a size of different sections of the first and second air ejector regions to change an amount of airflow originating from the different sections of these regions.

Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.

Abstract: An aircraft air distribution system includes a base and first and second arrays of nozzle air transfer ports in the base. An adjustable flow plate is positioned over the nozzle air transfer ports. A compressible member is located between the base and the adjustable flow plate and between the first and second arrays. First and second air ejector regions are located, respectively, on the sides of the compressible member between the base and the adjustable flow plate to connect to the first and second arrays, and direct air from the first and second arrays from the sides of the base. Fasteners moveably connect the adjustable flow plate to the base and are adjustable to change a size of different sections of the first and second air ejector regions to change an amount of airflow originating from the different sections of these regions.

Abstract: A connector includes a base and a connector member with a first end connected to the base and a second end opposite the first end. A first region on the connector member, located adjacent the first end, has a first impedance. A second region on the connector member, located adjacent the second end, has a second impedance greater than the first impedance. When an electro-statically charged device is connected to the connector, the electrostatic charge is dissipated relatively slowly due to initial contact with the second region of increased impedance, lowering the voltage resulting from the connection in order to protect static sensitive circuits coupled to the connector.

Abstract: A technique for reducing electromagnetic interference (EMI) in electronic systems that provides a phase shift between signals having a common frequency component propagating on adjacent portions of circuit board signal traces. The phase shift is produced by a delay element in one of the adjacent signal traces. In one example, the delay element includes a serpentine delay located at the signal generating circuit side of the adjacent portion of the signal trace. Such a technique can be used to reduce EMI emissions from clock signals provided to RAM circuits of a system memory of a computer system.

Abstract: A technique for reducing electromagnetic interference (EMI) in electronic systems that provides a phase shift between signals having a common frequency component propagating on adjacent portions of circuit board signal traces. The phase shift is produced by a delay element in one of the adjacent signal traces. In one example, the delay element includes a serpentine delay located at the signal generating circuit side of the adjacent portion of the signal trace. Such a technique can be used to reduce EMI emissions from clock signals provided to RAM circuits of a system memory of a computer system.