Patents by Inventor Steven Lee Davidson

Steven Lee Davidson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6539771
    Abstract: An air bag calibrator that is used to calibrate a plurality of seat sensors within a seat simultaneously. The calibrator uses controlled pressure contained within an air bladder and an air press cylinder to apply a controlled force across an entire seat surface that actuates all of the seat sensors in a consistent and repeatable manner, a major improvement over existing seat calibration methods. This is accomplished by loading a seat onto the calibrator, recording a baseline seat sensor value for each of the seat sensors, extending the air press cylinder to an extended position and applying a controlled force across the entire seat surface. The air pressure in the air bladder is then increased or decreased to a target pressure for a predetermined time, at which time an actuated seat sensor values for each of the seat sensors is recorded.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: April 1, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: Steven Lee Davidson, Timothy Dean Garner, Samuel Joseph Parr, Ronald Lee Anderson, Keith Kendell Roberts, James O Anderson
  • Patent number: 5671530
    Abstract: A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane.
    Type: Grant
    Filed: October 30, 1995
    Date of Patent: September 30, 1997
    Assignee: Delco Electronics Corporation
    Inventors: Christopher David Combs, Andrew Russell Baker, Steven Lee Davidson, Thomas Rezsonya