Abstract: A network device provides services for multiple virtual private networks (VPNs) via one or more virtual hosts. For example, a router receives packets from multiple VPNs, and communicates the packets to a service card via a logical interface in accordance with a forwarding information base. A virtual host within the service card processes the packets and provides a service for the network device from which the packet was sent. The virtual host may, for example, provide print services for network devices within a corresponding VPN. The virtual host acts, in essence, as a print server within the corresponding VPN. In this manner, the router may eliminate the need for the customer associated with the VPN to maintain print servers within remote customer sites.

Abstract: A router receives destination address information for a packet and determines, among entries in a first forwarding table, a closest match for the received destination address information. The router receives a pointer to a second forwarding table in accordance with the closest match determined in the first forwarding table and determines, among entries in the second forwarding table, a closest match for the received destination address information.

Abstract: A router receives a packet at an ingress interface. The router classifies the received packet based on at least a first field value contained in the header of the packet. According to the classification of the received packet, the router associates one of the plurality of forwarding tables to the packet. The router then performs a lookup operation in the associated forwarding table according to at least a second field value contained in the header of the packet. Based on the lookup operation, the router determines an egress interface and transmits the received packet from the determined egress interface.

Abstract: Provided is a method for processing a wafer that includes providing an alloy susceptor including an exterior surface and a wafer contact surface. The exterior surface of the alloy susceptor is treated to produce a roughness of the exterior surface. The roughened exterior surface of is coated with a ceramic material. The alloy susceptor including the ceramic-coated roughened exterior surface is positioned in a wafer process chamber. A plurality of layers of a film are deposited on the ceramic-coated roughened exterior surface of the alloy susceptor, wherein a first adhesion exists between the plurality of layers of the film and the ceramic material coated on the roughened exterior surface of the alloy susceptor that is greater than a second adhesion that would exist between the plurality of layers of the film and a non-roughened exterior surface of the alloy susceptor without the ceramic material.

Abstract: A device includes a primary control unit and a standby control unit. The standby control unit records routing communications exchanged between the primary control unit and an external routing device in accordance with a routing protocol. A standby routing process executing on the standby control unit processes the recorded routing communications when the primary control unit fails. The standby routing process generates state information for executing the routing protocol on the standby control unit without requiring that routing sessions be reestablished with the external routing device.

Abstract: A router receives destination address information for a packet and determines, among entries in a first forwarding table, a closest match for the received destination address information. The router receives a pointer to a second forwarding table in accordance with the closest match determined in the first forwarding table and determines, among entries in the second forwarding table, a closest match for the received destination address information.

Abstract: Examples of networking hardware with network layout maps thereon are disclosed herein. Other examples, embodiments, and related methods are also described herein.

Abstract: In one embodiment, a networking hardware element (1100, 3100) capable of coupling computer network elements (1010) comprises a network diagnostic mechanism (2140) that is capable of mapping the computer network elements and that is also capable of determining a connection status for the computer network elements. The networking hardware element also comprises a display (2110, 3110, 5110) that is capable of communicating with the network diagnostic mechanism and that is also capable of displaying a network layout map (2111, 5111) of representations of the computer network elements and the connection status of the computer network elements.

Abstract: An apparatus and method for preventing the peeling of electroplated metal from a wafer, is disclosed. The apparatus includes a seed layer detector system having a light source and a reflectivity detector. According to the method, the light source emits a beam of light onto a wafer and the reflectivity detector receives the light reflected from the wafer. The reflectivity of the wafer surface is measured to determine the presence or absence of a seed layer on the wafer, as well as whether the seed layer has a minimum thickness for optimum electroplating of a metal onto the seed layer.

Abstract: Methods, compositions and arrays for non-random loading of single analyte molecules into array structures are provided.

Abstract: A patterned frame structure including a plurality of wire frame elements. The frame elements are made of wire shaped by press plates. The frame elements overlap each other, so that the frame elements create a basket or pad that has a bottom mesh and containment space. The frame elements have a central area and a plurality of petal-shaped portions extending therefrom.

Abstract: Systems and methods consistent with the present invention enable routing table updates are performed by optimally utilizing the resources of a node without exceeding the resources of the node. Using feedback on the amount of resources available to the nodes, such as in terms of available memory, the node may make new connections before breaking old one where those updates will not exceed available resources. This is referred to as make-before-break. When not enough resources are available, the node will break old connections before making new ones. This is referred to as break-before-make. Unlike the strict make-before-break and break-before-make models, this “loose” make-before-break method considers the amount of available resources in view of the resources required to perform the routing table updates without a node failure. Routes may also be tagged to prioritize the addition of more important routes and the deletion of less significant routes.

Abstract: A method of stabilizing plating film impurities in an electrochemical plating bath solution is disclosed. The method includes providing an electrochemical plating machine in which an electrochemical plating process is carried out. A by-product bath solution is formed by continually removing a pre-filtered bath solution from the machine and removing an additive from the pre-filtered bath solution. A clean bath solution is formed by removing an additive by-product from the by-product bath solution. An additive bath solution is formed by adding a fresh additive to the clean bath solution. The additive bath solution is added to the electrochemical plating machine. An apparatus for stabilizing film impurities in an electrochemical plating bath solution is also disclosed.

Abstract: A method of forming a copper interconnect in a dual damascene scheme is described. After a diffusion barrier layer and seed layer are sequentially formed on the sidewalls and bottoms of a trench and via in a dielectric layer, a first copper layer is deposited by a first ECP process at a 10 mA/cm2 current density to fill the via and part of the trench. A first anneal step is performed to remove carbon impurities and optionally includes a H2 plasma treatment. A second ECP process with a first deposition step at a 40 mA/cm2 current density and second deposition step at a 60 mA/cm2 current density is used to deposit a second copper layer that overfills the trench. After a second anneal step, a CMP process planarizes the copper layers. Fewer copper defects, reduced S, Cl, and C impurities, and improved Rc performance are achieved by this method.

Abstract: A device includes a primary control unit and a standby control unit. The standby control unit records routing communications exchanged between the primary control unit and an external routing device in accordance with a routing protocol. A standby routing process executing on the standby control unit processes the recorded routing communications when the primary control unit fails. The standby routing process generates state information for executing the routing protocol on the standby control unit without requiring that routing sessions be reestablished with the external routing device.

Abstract: A novel method, which is suitable to substantially reduce the presence of oxygen micro-bubbles in an electroplating bath solution, is disclosed. The method includes the addition of aerobic bacteria to the electroplating bath solution to consume oxygen in the solution. Reduction of the oxygen content in the electroplating bath solution prevents oxygen micro-bubbles from forming in the solution and becoming trapped between the solution and the surface of a metal seed layer on a substrate to block the electroplating of a metal film onto the seed layer. Consequently, the presence of surface pits and other structural defects in the surface of the electroplated metal film is substantially reduced.

Abstract: An apparatus and method for preventing the peeling of electroplated metal from a wafer, is disclosed. The apparatus includes a seed layer detector system having a light source and a reflectivity detector. According to the method, the light source emits a beam of light onto a wafer and the reflectivity detector receives the light reflected from the wafer. The reflectivity of the wafer surface is measured to determine the presence or absence of a seed layer on the wafer, as well as whether the seed layer has a minimum thickness for optimum electroplating of a metal onto the seed layer.

Abstract: A plate and fin type heat exchanger has a heat exchanger core made from a plurality of stacked, alternating first and second heat exchange plates of a generally inverted, U-shaped cross-section. Each plate has a top wall, closed peripheral sidewalls and open ends, and the open ends of the first plates are oriented at 90° to the open ends of the second plates. The sidewalls of the plates have end portions, which in adjacent plates, are aligned to form corners of the heat exchanger core. Opposed U-shaped manifold bodies are provided having open ends and lateral walls joined in a fluid tight manner to the aligned plate sidewall end portions. End plates close off the open ends of the U-shaped bodies to form manifolds. The corners formed by the aligned plate sidewall end portions allow for an improved connection between the heat exchanger core and the U-shaped manifold bodies.

Abstract: In one embodiment, a networking hardware element (1100, 3100) capable of coupling computer network elements (1010) comprises a network diagnostic mechanism (2140) that is capable of mapping the computer network elements and that is also capable of determining a connection status for the computer network elements. The networking hardware element also comprises a display (2110, 3110, 5110) that is capable of communicating with the network diagnostic mechanism and that is also capable of displaying a network layout map (2111, 5111) of representations of the computer network elements and the connection status of the computer network elements.

Abstract: In one embodiment, a networking hardware element (1100, 3100) capable of coupling together computer network elements (1010) includes a network diagnostic mechanism (2140) and a display (2110, 3110, 5110). The display is electrically coupled to the network diagnostic mechanism and is capable of displaying network information and additional information.