Patents by Inventor Steven M. Shimotani

Steven M. Shimotani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost cold plate with film adhesive
    Patent number: 7495916
    Abstract: An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may be cured at a low temperature of about 125° C. The cold plate may be produced from thin metal without distortion or warping that might otherwise result from assembly at higher temperatures.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: February 24, 2009
    Assignee: Honeywell International Inc.
    Inventors: Sam Shiao, Steven M. Shimotani
  • LOW COST COLD PLATE WITH FILM ADHESIVE
    Publication number: 20080316708
    Abstract: An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may be cured at a low temperature of about 125° C. The cold plate may be produced from thin metal without distortion or warping that might otherwise result from assembly at higher temperatures.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 25, 2008
    Inventors: SAM SHIAO, Steven M. Shimotani
  • THERMAL SPREADER FOR ELECTRONIC COMPONENT
    Publication number: 20080026179
    Abstract: A thermal spreader for electronic components may include a plurality of carbon fiber laminate layers having a layer of stitched fibers formed thereupon. The thermal spreader may be attached to the electronic components as a thermal pad, or the thermal spreader may be extended to include attachment to a cold plate. The use of a stitched fiber layer on top of a carbon fiber laminate results in increased thermal cooling efficiency due to the increase in surface area and convectional cooling area.
    Type: Application
    Filed: July 31, 2006
    Publication date: January 31, 2008
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: SAM SHIAO, DENNIS M. MORITA, STEVEN M. SHIMOTANI