Abstract: A material independent profiler system and method for measuring a slope on the surface of an object such as a thin film disk, a silicon wafer, or a glass substrate is disclosed.

Abstract: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.

Abstract: A method comprises generating a data set comprising first surface roughness data from a first orientation and second surface roughness data from a second orientation and determining a roughness bias parameter from the first surface roughness data and the second surface roughness data.

Abstract: Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a single and dual multiple beam techniques. In one embodiment, this the invention uses a pair of orthogonally oriented white light beams, one in the radial and one in the circumferential direction. The scattered light from the radial and circumferential beams allows the detection and classification of particles, pits and scratches. In other embodiments, single beam techniques are used to classify radial and circumferential defects.

Abstract: In one embodiment, a system to inspect an edge region of a wafer, comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer; a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer; means for rotating the surface analyzer assembly about an edge surface of the wafer; and means for detecting one or more defects in the edge region of the wafer.

Abstract: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.

Abstract: In one embodiment, a system to inspect the edge of a wafer, comprises an surface analyzer assembly, a first drive assembly to impart linear motion between the surface analyzer and a first surface of the wafer, and a second drive assembly to impart rotary motion between the surface analyzer and the wafer about an axis parallel to the first surface of the wafer.

Abstract: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto a surface, a reflected radiation collecting assembly that collects radiation reflected from the surface, and a signal processing module. The signal processing module generates an image of magnetic characteristics of the magnetic disk, wherein the image comprises a plurality of servo sector arcs, locates a sample of points on a plurality of the servo sector arcs, fits a circle to the sample of points on each of the plurality of servo sector arcs, and determines at least one pivot-to-gap measurement from the radius of the circles.

Abstract: In one embodiment, a system for inspecting a first surface of a substrate, comprises a first reflected radiation collector to generate a first signal set representing one or more characteristics of radiation reflected from the first surface from a radiation source disposed in a first plane of incidence, a spatial filter in the radiation path between the surface and the first reflected radiation collector, a second reflected radiation collector to generate a second signal set representing one or more characteristics of radiation reflected from the first surface from a radiation source disposed in a first plane of incidence approximately orthogonal to the first plane of incidence, a spatial filter in the radiation path between the surface and the first reflected radiation collector, means for combining the first signal set and the second signal set to generate a signal set which represents one or more characteristics of the first surface, and means for processing the signal set to generate a data set representi

Abstract: A double-sided optical inspection system is presented which may detect and classify particles, pits and scratches on thin film disks or wafers in a single scan of the surface. In one embodiment, the invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction on both surfaces of the wafer or thin film disk. The scattered light from radial and circumferential beams is separated via their polarization or by the use of a dichroic mirror together with two different laser wavelengths.

Abstract: A system and method for measuring defects, film thickness, contamination, particles and height of a thin film disk or a silicon wafer. The system includes a processor for determining height. In addition to measuring the height the system can measure film thickness and defects through the measurement of the phase shift of optical signals. An optical profilometer is described which can measure topography on thin film disks, optical substrates or silicon wafers and whose output is independent of the reflectivity of the substrate. This material independent optical profilometer uses a retro-reflector to achieve reflectivity independence and to increase the height sensitivity to 8 times the height of the surface. The reflectivity independent optical profilometer achieves perfect cancellation of the slope of the surface while measuring the topography of the substrate.

Abstract: A system and method for measuring defects, film thickness, contamination, particles and height of a thin film disk or a silicon wafer.

Abstract: A material independent optical profilometer system and method for measuring at least one of either a height or a slope of an object such as a thin film disk, a silicon wafer, or a glass substrate is disclosed.

Abstract: Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a dual beam technique. This invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction. The scattered light from radial and circumferential beams allows the detection and classification of particles, pits and scratches.

Abstract: A laser based inspection tool (LIT) for inspecting planar surfaces is described. In a preferred embodiment the LIT can simultaneously inspect both planar surfaces of disks for use in disk drives. In one embodiment of the invention, the incident beam is directed onto the surface to be inspected at an angle slightly offset from perpendicular so that the reflected beam is physically separated from the incident beam. The reflected beam is routed to a detector which converts the intensity of the reflected into an analog signal. The analog signal is sampled and digitized to generate pixel data stored in a buffer. Various analyses are performed on the data including calculating a rate of change in the pixel data. If the rate of change in the pixel data exceeds a selected threshold that indicates a possible defect if it occurs in the data area of the disk.

Abstract: A laser based inspection tool (LIT) for inspecting planar surfaces is described. In a preferred embodiment the LIT can simultaneously inspect both planar surfaces of disks for use in disk drives. In an embodiment of the invention, light reflected from the surface at an angle slightly offset from perpendicular is routed through a telecentric lens to a detector which converts the intensity of the reflected beam into an analog signal. The analog signal is sampled and digitized to generate pixel data. A data acquisition system sequentially stores the pixel data in a buffer. A median filter and derivative analysis can be applied to the pixel data to detect deviations indicating defects. An optional calibration system periodically reflects the scanning beam back to a detector to form a reference signal for use in absolute reflectivity measurements.