Abstract: An electrochemical system includes an electrochemical compressor through which a working fluid that includes a component that primarily acts as an electrochemically-active component flows; a sealed vessel in which the electrochemical compressor is housed; an inlet conduit for passing working fluid into the vessel; and an outlet conduit for passing fluid out of the vessel. The working fluid that leaks from the electrochemical compressor is contained within the vessel.

Abstract: An electrochemical system includes an electrochemical compressor through which a working fluid that includes a component that primarily acts as an electrochemically-active component flows; a sealed vessel in which the electrochemical compressor is housed; an inlet conduit for passing working fluid into the vessel; and an outlet conduit for passing fluid out of the vessel. The working fluid that leaks from the electrochemical compressor is contained within the vessel.

Abstract: An electrochemical system includes an electrochemical compressor through which a working fluid that includes a component that primarily acts as an electrochemically-active component flows; a sealed vessel in which the electrochemical compressor is housed; an inlet conduit for passing working fluid into the vessel; and an outlet conduit for passing fluid out of the vessel. The working fluid that leaks from the electrochemical compressor is contained within the vessel.

Abstract: An electrochemical system includes an electrochemical compressor through which a working fluid that includes a component that primarily acts as an electrochemically-active component flows; a sealed vessel in which the electrochemical compressor is housed; an inlet conduit for passing working fluid into the vessel; and an outlet conduit for passing fluid out of the vessel. The working fluid that leaks from the electrochemical compressor is contained within the vessel.

Abstract: A method is provided for forming grooves in a polishing pad useful for planarizing a substrate in a chemical mechanical planarization process. The method maintains average velocity as a function of bit diameter to enable groove formation using a rotating bit, whereby grooves can be formed at a higher rate while maintaining high groove quality and low defectivity.

Abstract: This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.

Abstract: A statistically uniform micro-texture on a polishing pad surface improves break-in preconditioning time, and is measured by: Land Surface Roughness, Ra, from about 0.01 &mgr;m to about 25 &mgr;m; Average Peak to Valley Roughness, Rtm, from about 2 &mgr;m to about 40 &mgr;m; Core roughness depth, Rk, from about 1 to about 10; Reduced Peak Height, Rpk, from about 0.1 to about 5; Reduced Valley Height, Rvk, from about 0.1 to about 10; and Peak density expressed as a surface area ratio, RSA, ([Surf.Area/(Area−1)]), 0.001 to 2.0.

Abstract: This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.