Abstract: An apparatus, program product and method facilitate the design of a multi-layer circuit arrangement incorporating a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: A circuit arrangement and method in one aspect utilize thermal-only through vias, extending between the opposing faces of stacked semiconductor dies, to increase the thermal conductivity of a multi-layer semiconductor stack. The thermal vias are provided in addition to data-carrying through vias, which communicate data signals between circuit layers, and power-carrying through vias, which are coupled to a power distribution network for the circuit layers, such that the thermal conductivity is increased above that which may be provided by the data-carrying and power-carrying through vias in the stack. A circuit arrangement and method in another aspect organize the circuit layers in a multi-layer semiconductor stack based upon current density so as to reduce power distribution losses in the stack.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: An apparatus, program product and method facilitate the design of a multi-layer circuit arrangement incorporating a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: A circuit arrangement and method utilize a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: An apparatus, program product and method facilitate the design of a multi-layer circuit arrangement incorporating a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: A selective cache includes a set configured to receive data evicted from a number of primary sets of a primary cache. The selective cache also includes a counter associated with the set. The counter is configured to indicate a frequency of access to data within the set. A decision whether to replace data in the set with data from one of the primary sets is based on a value of the counter.

Abstract: A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions.

Abstract: A design structure is provided for a slotted ring network, in which a node may transmit a non-renewable slot reservation with any unreserved slot. The reservation restricts other nodes from transmitting a new packet in the slot. When the slot returns around the ring to the reserving node, the slot will be available. Preferably, reservation is made responsive to a starvation condition in the reserving node, which may be detected in any of various ways. In an optional enhancement, a reservation identifies the reserving node, and another node on the ring is free to transmit a new packet in the reserved slot if the new packet will reach its destination at or before the reserving node, and thus will not interfere with the reservation.

Abstract: A circuit arrangement and method utilize a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.

Abstract: In a slotted ring network, a node may transmit a non-renewable slot reservation with any unreserved slot. The reservation restricts other nodes from transmitting a new packet in the slot. When the slot returns around the ring to the reserving node, the slot will be available. Preferably, reservation is made responsive to a starvation condition in the reserving node, which may be detected in any of various ways. In an optional enhancement, a reservation identifies the reserving node, and another node on the ring is free to transmit a new packet in the reserved slot if the new packet will reach its destination at or before the reserving node, and thus will not interfere with the reservation.

Abstract: A design structure is provided for a slotted ring network, in which a node may transmit a non-renewable slot reservation with any unreserved slot. The reservation restricts other nodes from transmitting a new packet in the slot. When the slot returns around the ring to the reserving node, the slot will be available. Preferably, reservation is made responsive to a starvation condition in the reserving node, which may be detected in any of various ways. In an optional enhancement, a reservation identifies the reserving node, and another node on the ring is free to transmit a new packet in the reserved slot if the new packet will reach its destination at or before the reserving node, and thus will not interfere with the reservation.

Abstract: In a slotted ring network, a node may transmit a non-renewable slot reservation with any unreserved slot. The reservation restricts other nodes from transmitting a new packet in the slot. When the slot returns around the ring to the reserving node, the slot will be available. Preferably, reservation is made responsive to a starvation condition in the reserving node, which may be detected in any of various ways. In an optional enhancement, a reservation identifies the reserving node, and another node on the ring is free to transmit a new packet in the reserved slot if the new packet will reach its destination at or before the reserving node, and thus will not interfere with the reservation.

Abstract: In a multi-processor computer system, the processors are divided into broadcast groups and partition groups, with each processor belonging to exactly one broadcast group and exactly one partition group. Each processor holds a partition group directory indicative of contents of the caches associated with each other processor of the partition group. For read or write operations a processor broadcasts a message to other members of its broadcast group. The members of the broadcast group consult their respective partition directories to provide a complete response to a request for a needed item of data.

Abstract: In a multi-processor computer system, the processors are divided into broadcast groups and partition groups, with each processor belonging to exactly one broadcast group and exactly one partition group. Each processor holds a partition group directory indicative of contents of the caches associated with each other processor of the partition group. For read or write operations a processor broadcasts a message to other members of its broadcast group. The members of the broadcast group consult their respective partition directories to provide a complete response to a request for a needed item of data.