Abstract: The invention provides a melt-processable conductive fluorothermoplastic composition comprising three components. The first component is at least one melt-processable, thermoplastic fluoropolymer component having its interpolymerized units derived from (i) at least 50 wt % of TFE, and (ii) one or more ethylenically-unsaturated monomers represented by the formulas (a) CF2?CF—Rf, (b) CF2?CF—O—Rf?, and (c) CH2?CR2. The thermoplastic fluoropolymer component is substantially free of interpolymerized units derived from VDF. The second component is from about 0.1 to about 10 weight percent of a hydrocarbon polymer, and the third component is from about 1 to about 20 weight percent of conductive filler. The invention also provides a method for making fluorothermoplastic compositions and shaped articles comprising a conductive fluorothermoplastic composition.

Abstract: The invention provides a melt-processable conductive fluorothermoplastic composition comprising three components. The first component is at least one melt-processable, thermoplastic fluoropolymer component having its interpolymerized units derived from (i) at least 50 wt % of TFE, and (ii) one or more ethylenically-unsaturated monomers represented by the formulas (a) CF2═CF—Rf, (b) CF2═CF—O—Rf′, and (c) CH2═CR2, wherein Rf is a perfluoroalkyl of 1 to 8 carbon atoms, Rf′ is Rf or a perfluoroalkoxy of 1 to 8 carbon atoms, and R is selected from H, F, Cl, or an aliphatic group having from 1 to 8 carbon atoms which may have F or Cl substituents. The thermoplastic fluoropolymer component is substantially free of interpolymerized units derived from VDF. The second component is from about 0.1 to about 10 weight percent of a hydrocarbon polymer, and the third component is from about 1 to about 20 weight percent of conductive filler.

Abstract: The invention provides a melt-processable conductive fluorothermoplastic composition comprising three components. The first component is at least one melt-processable, thermoplastic fluoropolymer component having its interpolymerized units derived from (i) at least 50 wt % of TFE, and (ii) one or more ethylenically-unsaturated monomers represented by the formulas (a) CF2═CF—Rf, (b) CF2═CF—O—Rf′, and (c) CH2═CR2, wherein Rf is a perfluoroalkyl of 1 to 8 carbon atoms, Rf′ is Rf or a perfluoroalkoxy of 1 to 8 carbon atoms, and R is selected from H, F, Cl, or an aliphatic group having from 1 to 8 carbon atoms which may have F or Cl substituents. The thermoplastic fluoropolymer component is substantially free of interpolymerized units derived from VDF. The second component is from about 0.1 to about 10 weight percent of a hydrocarbon polymer, and the third component is from about 1 to about 20 weight percent of conductive filler.

Abstract: The invention provides a melt-processable conductive fluorothermoplastic composition comprising three components. The first component is at least one melt-processable, thermoplastic fluoropolymer component having its interpolymerized units derived from (i) at least 50 wt % of TFE, and (ii) one or more ethylenically-unsaturated monomers represented by the formulas (a) CF2═CF—Rf, (b) CF2═CF—O—Rf′, and (c) CH2═CR2, wherein Rf is a perfluoroalkyl of 1 to 8 carbon atoms, Rf′ is Rf or a perfluoroalkoxy of 1 to 8 carbon atoms, and R is selected from H, F, Cl, or an aliphatic group having from 1 to 8 carbon atoms which may have F or Cl substituents. The thermoplastic fluoropolymer component is substantially free of interpolymerized units derived from VDF. The second component is from about 0.1 to about 10 weight percent of a hydrocarbon polymer, and the third component is from about 1 to about 20 weight percent of conductive filler.

Abstract: A system for managing a distributed array of appliances includes a headend computer having a low power main transceiver and a distributed array of relay units. Each relay unit includes a low power satellite transceiver, a microcomputer connected to the satellite transceiver, the satellite transceiver being controlled by relay program instructions for detecting communications directed by the headend computer relative to the same relay unit and directing communications to the headend computer relative to the same relay unit, and for retransmitting communications to other relay units. At least some of the relay units are appliance controllers and include an appliance interface for communicating with the appliance, the microcomputer being also connected to the appliance interface and having program instructions for directing communication between the satellite transceiver and the appliance interface.