Abstract: An apparatus and method for cleaning solder paste from stencils, screens, misprinted circuit boards, and tools associated with the manufacturing of surface mount technology circuit boards. The apparatus includes a holder assembly for holding the solder-laden objects during cleaning and rotatable spray arms connected with a chemical pump for spraying a transversely directed, cyclic waves of solvent onto the object's surfaces. The cleaning action of the spray arms permits use of the solvent at or below room temperature thereby substantially reducing evaporative loss of solvent, environmental injury resulting from such evaporative loss, and exposure of workers to solvent vapors. The apparatus includes filters for filtering heavy metal particles washed from the objects to contain the heavy metals for safe disposal. Safety mechanisms are included in the apparatus to prevent worker injury.

Abstract: A repair terminal is disclosed for reworking defective components on printed circuit boards. The terminal has a heater arm which lowers itself over the component, and directs hot gas thereon. A vacuum shroud surrounds the heat zone around the component and removes excess heat so as to minimize damage to surrounding components. The heater arm has inner and outer tubes, the inner tube delivering hot gas the outer tube removing it. Thus the outer tube prevents an operator from being burned by the dangerously hot temperature of the inner tube. A workholder is also disclosed for holding and aligning the circuit board with the heater arm. The workholder is capable of adjustment along the X- and Y-axes as well as in the theta orientation.