Patents by Inventor Steven R. Stephenson

Steven R. Stephenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Controlling packaging encapsulant leakage
    Patent number: 6521980
    Abstract: An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: February 18, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Patrick W. Tandy, Joseph M. Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken, Edward A. Schrock, Brenton L. Dickey
  • Controlling packaging encapsulant leakage
    Patent number: 6395579
    Abstract: An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: May 28, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Patrick W. Tandy, Joseph M. Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken, Edward A. Schrock, Brenton L. Dickey
  • Controlling packaging encapsulant leakage
    Publication number: 20010008780
    Abstract: An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.
    Type: Application
    Filed: February 21, 2001
    Publication date: July 19, 2001
    Inventors: Patrick W. Tandy, Joseph M. Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken, Edward A. Schrock, Brenton L. Dickey
  • Controlling packaging encapsulant leakage
    Patent number: 6210992
    Abstract: An integrated circuit package may be formed in part with an encapsulated region. Outflow of the encapsulant across critical electrical elements can be prevented by providing a cavity which collects encapsulant outflow between the region of encapsulation and the region where the critical components are situated. In one embodiment of the present invention, a surface may include a first portion covered by solder resist, having an area populated by bond pads, and a second portion which is encapsulated. Encapsulant flow over the bond pads is prevented by forming an opening in the solder resist proximate to the second portion to collect the encapsulant before it reaches the bond pads.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: April 3, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Patrick W. Tandy, Joseph M. Brand, Brad D. Rumsey, Steven R. Stephenson, David J. Corisis, Todd O. Bolken, Edward A. Schrock, Brenton L. Dickey