Abstract: A variable true time delay line (100) includes an RF transmission line (110) and at least one fluidic delay unit (108). The fluidic delay unit includes a fluidic dielectric contained in a cavity (109) and coupled to the RF transmission line (110) along at least a portion of a length thereof. At least one pump is provided for adding and removing the fluid dielectric to the cavity (109) in response to a time delay control signal. A propagation delay of the RF transmission line is selectively varied by adding and removing the fluid dielectric from the cavity.

Abstract: A continuously variable true time delay line (100) and method for producing a time delay. The true delay line (100) includes an RF transmission line (110) and at least a first fluidic dielectric (130) contained in a cavity (109) coupled to the RF transmission line along at least a first length thereof. One or more variable displacement fluid processors (120) are provided for changing a distribution of the fluid dielectric (130) in the cavity (109) in response to a time delay control signal (137). The propagation delay of the line is selectively varied by changing the distribution of the fluid dielectric in the cavity.

Abstract: Method and apparatus for producing a variable delay for an RF signal. The method can include the step of propagating the RF signal along an RF transmission line, coupling a fluidic dielectric to the RF transmission line, and dynamically changing a composition of the fluidic dielectric to selectively vary its permittivity in response to a time delay control signal. The method can also include the step of dynamically changing a composition of the fluidic dielectric to vary its permeability. The permittivity and the permeability can be varied concurrently in response to the time delay control signal. In a preferred embodiment the method can include selectively varying the permeability concurrently with the permittivity to maintain a characteristic impedance of the transmission line approximately constant.

Abstract: A continuously variable true time delay line (100) and method for producing a time delay. The true delay line (100) includes an RF transmission line (110) and at least a first fluidic dielectric (130) contained in a cavity (109) coupled to the RF transmission line along at least a first length thereof. One or more variable displacement fluid processors (120) are provided for changing a distribution of the fluid dielectric (130) in the cavity (109) in response to a time delay control signal (137). The propagation delay of the line is selectively varied by changing the distribution of the fluid dielectric in the cavity.

Abstract: A variable true time delay line (100) includes an RF transmission line (110) and at least one fluidic delay unit (108). The fluidic delay unit includes a fluidic dielectric contained in a cavity (109) and coupled to the RF transmission line (110) along at least a portion of a length thereof. At least one pump is provided for adding and removing the fluid dielectric to the cavity (109) in response to a time delay control signal. A propagation delay of the RF transmission line is selectively varied by adding and removing the fluid dielectric from the cavity.

Abstract: Method and apparatus for producing a variable delay for an RF signal. The method can include the step of propagating the RF signal along an RF transmission line, coupling a fluidic dielectric to the RF transmission line, and dynamically changing a composition of the fluidic dielectric to selectively vary its permittivity in response to a time delay control signal. The method can also include the step of dynamically changing a composition of the fluidic dielectric to vary its permeability. The permittivity and the permeability can be varied concurrently in response to the time delay control signal. In a preferred embodiment the method can include selectively varying the permeability concurrently with the permittivity to maintain a characteristic impedance of the transmission line approximately constant.

Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a plurality of cooling fluid dissociation electrodes carried by the cooling substrate for dissociating cooling fluid to control a pressure thereof. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber.