Abstract: Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.

Abstract: An integrated MEMS sensor package is disclosed. The package comprises a sensor chip with a top surface and a bottom surface. The top surface comprises an opening. The bottom surface is attached to a substrate with electrical inter-connects. A lid is coupled to the top surface with an adhesive material. The lid may have an opening to expose the sensor chip to ambient environment.

Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

Abstract: Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer.

Abstract: An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.

Abstract: In a method and system in accordance with the present invention, solder balls are added on top of vertically integrated MEMS with CMOS by using wafer scale fabrication compatible with existing chip scale packaging capabilities. In the present invention, both the MEMS and the CMOS dies are fabricated in equal dimensions. On the MEMS level, silicon islands are defined by DRIE etching to be bonded on top of CMOS pads. These conducting silicon islands later provide electrical connections between the CMOS pads and the conducting traces that lead to solder balls on top.

Abstract: Various embodiments provide systems and methods capable of facilitating interaction with handheld electronics devices based on sensing rotational rate around at least three axes and linear acceleration along at least three axes. In one aspect, a handheld electronic device includes a subsystem providing display capability, a set of motion sensors sensing rotational rate around at least three axes and linear acceleration along at least three axes, and a subsystem which, based on motion data derived from at least one of the motion sensors, is capable of facilitating interaction with the device.

Abstract: A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.

Abstract: An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.

Abstract: Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer.

Abstract: A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.

Abstract: A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS substrate with a dielectric layer disposed between the handle and device wafers. The method includes lithographically defining at least one standoff on the device wafer and bonding the at least one standoff to an integrated circuit substrate to form a sealed cavity between the MEMS substrate and the integrated circuit substrate. The method includes defining at least one opening in the handle wafer, standoff, or integrated circuit substrate to expose a portion of the to expose a portion of the device wafer to the outside environment.

Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

Abstract: A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.

Abstract: A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.

Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.

Abstract: An optical image stabilization system for a camera module is disclosed. The stabilization system comprises a voice coil motor (VCM), at least one digital gyroscope for receiving signals from the VCM, and an angular velocity sensor for receiving signals from the digital gyroscope and outputting an angular position error signal. The stabilization system further comprises signal processing logic for receiving the error signal, and comparing the error signal to a reference signal and providing a stabilized image based upon that comparison, wherein the hard-coded logic, digital gyroscope and rate and position sensor resides on the same chip.

Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

Abstract: Various embodiments provide user interfaces for mobile devices which combine input from motion sensors and other input controls. In one aspect, a handheld electronic device includes a display operative to display an image, an input control operative to sense a contact motion of the user with the device, a set of motion sensors sensing rotational rate of the device around at least three axes of the device and linear acceleration along at least three axes of the device, and a subsystem capable of facilitating interaction with the device based on combined sensor data. The combined sensor data includes motion data derived from at least one of the motion sensors and contact data derived from the contact motion sensed by the input control.