Patents by Inventor Steven Wayne Anderson

Steven Wayne Anderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package with strain relief means and method of making
    Patent number: 5877043
    Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: March 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: David James Alcoe, Steven Wayne Anderson, Yifan Guo, Eric Arthur Johnson
  • Electronic package with strain relief means
    Patent number: 5760465
    Abstract: An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
    Type: Grant
    Filed: February 1, 1996
    Date of Patent: June 2, 1998
    Assignee: International Business Machines Corporation
    Inventors: David James Alcoe, Steven Wayne Anderson, Yifan Guo, Eric Arthur Johnson