Patents by Inventor Steven Yu Feng Yao

Steven Yu Feng Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip package and method of manufacture
    Patent number: 7678610
    Abstract: A semiconductor chip package and method of making the same. A first chip unit includes a first substrate and a first IC chip electrically connected to the first substrate. A second chip unit includes a second substrate and a second IC chip electronically connected to the second substrate. An adhesive material is provided on a surface of the first IC chip and the second chip unit is mounted onto the surface of the first chip unit including the adhesive material so that at least a portion of the second structure is encapsulated by the adhesive material, thereby providing some encapsulation in the same step as mounting. The first chip unit and the second chip unit may be separated by a spacer which may also provide an electrical connection.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: March 16, 2010
    Assignee: UTAC-United Test and Assembly Test Center Ltd.
    Inventors: Chuen Khiang Wang, Hien Boon Tan, Anthony Yi Sheng Sun, Sin Nee Song, Steven Yu Feng Yao, Hua Hong Tan
  • SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
    Publication number: 20080251938
    Abstract: A semiconductor chip package and method of making the same. A first chip unit includes a first substrate and a first IC chip electrically connected to the first substrate. A second chip unit includes a second substrate and a second IC chip electronically connected to the second substrate. An adhesive material is provided on a surface of the first IC chip and the second chip unit is mounted onto the surface of the first chip unit including the adhesive material so that at least a portion of the second structure is encapsulated by the adhesive material, thereby providing some encapsulation in the same step as mounting. The first chip unit and the second chip unit may be separated by a spacer which may also provide an electrical connection.
    Type: Application
    Filed: April 7, 2008
    Publication date: October 16, 2008
    Inventors: Chuen Khiang Wang, Hien Boon Tan, Anthony Yi Sheng Sun, Sin Nee Song, Steven Yu Feng Yao, Hua Hong Tan