Patents by Inventor Stian E. Wood

Stian E. Wood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11729964
    Abstract: An apparatus comprises a conductive structure, another conductive structure, and a laminate spacer structure interposed between the conductive structure and the another conductive structure in a first direction. The laminate spacer structure comprises a dielectric spacer structure, another dielectric spacer structure, and an additional dielectric spacer structure interposed between the dielectric spacer structure and the another dielectric spacer structure. The additional dielectric spacer structure comprises at least one dielectric material, and gas pockets dispersed within the at least one dielectric material. Additional apparatuses, memory devices, electronic systems, and a method of forming an apparatus are also described.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: August 15, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Silvia Borsari, Stian E. Wood, Haoyu Li, Yiping Wang
  • Publication number: 20220020748
    Abstract: An apparatus comprises a conductive structure, another conductive structure, and a laminate spacer structure interposed between the conductive structure and the another conductive structure in a first direction. The laminate spacer structure comprises a dielectric spacer structure, another dielectric spacer structure, and an additional dielectric spacer structure interposed between the dielectric spacer structure and the another dielectric spacer structure. The additional dielectric spacer structure comprises at least one dielectric material, and gas pockets dispersed within the at least one dielectric material. Additional apparatuses, memory devices, electronic systems, and a method of forming an apparatus are also described.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 20, 2022
    Inventors: Silvia Borsari, Stian E. Wood, Haoyu Li, Yiping Wang
  • Patent number: 11164873
    Abstract: An apparatus comprises a conductive structure, another conductive structure, and a laminate spacer structure interposed between the conductive structure and the another conductive structure in a first direction. The laminate spacer structure comprises a dielectric spacer structure, another dielectric spacer structure, and an additional dielectric spacer structure interposed between the dielectric spacer structure and the another dielectric spacer structure. The additional dielectric spacer structure comprises at least one dielectric material, and gas pockets dispersed within the at least one dielectric material. Additional apparatuses, memory devices, electronic systems, and a method of forming an apparatus are also described.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: November 2, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Silvia Borsari, Stian E. Wood, Haoyu Li, Yiping Wang
  • Publication number: 20200373304
    Abstract: An apparatus comprises a conductive structure, another conductive structure, and a laminate spacer structure interposed between the conductive structure and the another conductive structure in a first direction. The laminate spacer structure comprises a dielectric spacer structure, another dielectric spacer structure, and an additional dielectric spacer structure interposed between the dielectric spacer structure and the another dielectric spacer structure. The additional dielectric spacer structure comprises at least one dielectric material, and gas pockets dispersed within the at least one dielectric material. Additional apparatuses, memory devices, electronic systems, and a method of forming an apparatus are also described.
    Type: Application
    Filed: May 23, 2019
    Publication date: November 26, 2020
    Inventors: Silvia Borsari, Stian E. Wood, Haoyu Li, Yiping Wang