Patents by Inventor Stuart L. Roberts
Stuart L. Roberts has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8987885Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: GrantFiled: January 15, 2013Date of Patent: March 24, 2015Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Patent number: 8354301Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: GrantFiled: January 10, 2011Date of Patent: January 15, 2013Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Patent number: 7977597Abstract: Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.Type: GrantFiled: June 5, 2007Date of Patent: July 12, 2011Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Rich Fogal
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Publication number: 20110104857Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: ApplicationFiled: January 10, 2011Publication date: May 5, 2011Applicant: MICRON TECHNOLOGY, INC.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Patent number: 7868440Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: GrantFiled: August 25, 2006Date of Patent: January 11, 2011Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Publication number: 20080048316Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: ApplicationFiled: August 25, 2006Publication date: February 28, 2008Applicant: Micron Technology, Inc.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Patent number: 7229905Abstract: A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system.Type: GrantFiled: February 16, 2005Date of Patent: June 12, 2007Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, William J. Reeder, Leonard E. Mess
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Patent number: 7227095Abstract: Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at least proximate to the first and second electrodes. In another embodiment, a wire bonder includes a bond head having a capillary, a first electrode and a second electrode each disposed relative to the bond head, and a controller operably coupled to the first and second electrodes. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.Type: GrantFiled: August 6, 2003Date of Patent: June 5, 2007Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Rich Fogal
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Patent number: 6869869Abstract: A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system. The wire bonding system obtains an image of the lead frame and identifies the eyepoint features of the die paddle within the image so as to more accurately determine the positions of the second wire bonding pads of the lead frame with respect to the wire bonding system.Type: GrantFiled: May 16, 2003Date of Patent: March 22, 2005Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, William J. Reeder, Leonard E. Mess
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Publication number: 20030205795Abstract: A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system.Type: ApplicationFiled: May 16, 2003Publication date: November 6, 2003Inventors: Stuart L. Roberts, William J. Reeder, Leonard E. Mess
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Patent number: 6628136Abstract: A semiconductor testing system includes a compliant layer formed on a testing surface. Projections from the compliant layer form an electrical path to an electrical ground from a testing surface to a plurality of recessed ball pads disposed on a surface of a substrate. Thus, a plurality of electrical connections between a semiconductor die on the substrate and the ball pads may be tested for proper ground during a wirebonding process.Type: GrantFiled: September 2, 1999Date of Patent: September 30, 2003Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Larry D. Kinsman
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Patent number: 6577019Abstract: A semiconductor device formed by an automated wire bonding system. The semiconductor device comprises a lead frame having a plurality of lead fingers and a die paddle, and a semiconductor die mounted to the die paddle. The die paddle comprises a plurality of eyepoint features that extend from the die. The die comprises a first plurality of bonding pads and the lead fingers comprise a second plurality of bonding pads. The first and second bonding pads are interconnected by a plurality of connecting wires which are installed by the automated wire bonding system.Type: GrantFiled: January 21, 2000Date of Patent: June 10, 2003Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, William J. Reeder, Leonard E. Mess
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Publication number: 20020024350Abstract: A semiconductor testing system includes a compliant layer formed on a testing surface. Projections from the compliant layer form an electrical path to am electrical ground from a testing surface to a plurality of recessed ball pads disposed on a surface of a substrate. Thus, a plurality of electrical connections between a semiconductor die on the substrate and the ball pads may be tested for proper ground during a wirebonding process.Type: ApplicationFiled: September 2, 1999Publication date: February 28, 2002Inventors: STUART L. ROBERTS, LARRY D. KINSMAN