Abstract: The present disclosure relates to methods and apparatuses for mechanically modifying substrates. The apparatuses herein may include a tool roll and an anvil roll. The tool roll may include tooling members adapted to perform various different operations, such as bonding, cutting, embossing, and/or activation of advancing substrates. The tooling members and associated tooling surfaces may not extend completely around the circumference of the tool roll. As such, the tool roll also includes one or more bearer rings that engage the anvil roll during portions of the tool roll rotation where the tooling members are not in engagement with the anvil roll. The tooling members and bearer rings herein are configured to help reduce vibrations in the anvil and/or tool roll caused by the alternating engagements of the tooling surfaces and bearer rings with the anvil roll during rotation.