Abstract: A Link 16 terminal. The Link 16 terminal includes a red enclave. The red enclave comprises a Link 16 radio. The Link 16 radio is configured to send commands to Link 16 modems. The commands specify time slots when operations in the commands should be performed by the Link 16 modems. The Link 16 terminal further includes a black enclave physically separated from the red enclave. The black enclave includes a Link 16 modem configured to receive commands from the Link 16 radio. The Link 16 terminal further includes a communication channel configured to facilitate communication between the red enclave and the black enclave. The Link 16 radio is configured to dynamically adjust when commands are sent to the Link 16 modem with respect to time slots specified in the commands based on latency between the Link 16 radio and the Link 16 modem.

Abstract: A cryptographic device and method are disclosed for processing different levels of classified information. Input and output ports are physically isolated on the cryptographic device. Within the cryptographic device, each port has its packets labeled in such a way that it can be processed differently from other packets by a cryptographic module. High-assurance techniques are used to assure labeling and proper processing of the packets. These labeled packets are intermixed on common pathways regardless of level of classification. Despite intermixing, separation of the packets is assured through the process.

Abstract: A device for high-assurance processing is disclosed. A processing circuit uses an access controller to assure that the processing circuit operates properly. The processing circuit runs software programs and is programmable. The access controller is programmable, but not programmable by the processing circuit. Peripherals or segments of the address space of the processing circuit is regulated. In a particular state, the peripherals that are available are regulated by the access controller. In some embodiments, the transition from state-to-state can also be regulated by the access controller.

Abstract: A cryptographic device and method are disclosed for processing different levels of classified information. Input and output ports are physically isolated on the cryptographic device. Within the cryptographic device, each port has its packets labeled in such a way that it can be processed differently from other packets by a cryptographic module. High-assurance techniques are used to assure labeling and proper processing of the packets. These labeled packets are intermixed on common pathways regardless of level of classification. Despite intermixing, separation of the packets is assured through the process.

Abstract: A cryptographic device and method are disclosed for processing different levels of classified information. A memory caches keys for use in a cryptographic processor. The cryptographic processor requests a key associated with a particular classification level when processing a packet of the particular classification level. The cryptographic device confirms that the key and the packet are of the same classification level in a high-assurance manner. Checking header information of the keys one or more times is performed in one embodiment. Some embodiments authenticate the stored key in a high-assurance manner prior to providing the key to the cryptographic device.

Abstract: A device for high-assurance processing is disclosed. A processing circuit uses an access controller to assure that the processing circuit operates properly. The processing circuit runs software programs and is programmable. The access controller is programmable, but not programmable by the processing circuit. Peripherals or segments of the address space of the processing circuit is regulated. In a particular state, the peripherals that are available are regulated by the access controller. In some embodiments, the transition from state-to-state can also be regulated by the access controller.

Abstract: A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

Abstract: A process is disclosed which applies advanced concepts of Z-technology to the field of dense electronic packages. Starting with standard chip-containing silicon wafers, modification procedures are followed which create IC chips having second level metal conductors on top of passivation (which covers the original silicon and its aluminum or other metallization). The metal of the second level conductors is different from, and functions better for electrical conduction, than the metallization included in the IC circuitry. The modified chips are cut from the wafers, and then stacked to form multi-layer IC devices. A stack has one or more access planes. After stacking, and before applying metallization on the access plane, a selective etching step removes any aluminum (or other material) which might interfere with the metallization formed on the access plane. Metal terminal pads are formed in contact with the terminals of the second level conductors on the stacked chips.