Patents by Inventor Su-Ching Chung

Su-Ching Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE AND SUBSTRATE STRUCTURE WITH AT LEAST ONE ALIGNMENT PATTERN
    Publication number: 20100071943
    Abstract: A package structure with an alignment pattern is provided, which includes a first substrate, a second substrate and at least one contact. At least one first conductive structure and at least one first alignment pattern are disposed on the first substrate. The second substrate is disposed opposite to the first substrate. In addition, at least one second conductive structure is disposed on the second substrate. The at least one contact is between the first conductive structure on the first substrate and the second conductive structure on the second structure. Particularly, the at least one first alignment pattern has at least one widest part and at least one narrowest part, and the widest part or the narrowest part is aligned or close to a central portion of the at least one contact.
    Type: Application
    Filed: July 2, 2009
    Publication date: March 25, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tsung-Fu Tsai, Su-Ching Chung