Abstract: A camera module includes a circuit board of a grounding pad, a lens module, and a voice-coil motor. The voice-coil motor for receiving and driving the lens module automatically focus comprises a main body, a metallic casing and a grounding structure. The metallic casing covers the main body. After electrically grounding by connecting with the grounding pad of the circuit board, the grounding structure connects with the metallic casing and the circuit board. With the grounding structure, the metallic casing can be grounded. Thereby, prevent external electro-magnetic waves from affecting electrical signals communicated between the camera module and the circuit board.

Abstract: An exemplary objective holder for engaging with a PCB substrate having an image sensor and several passive components arranged thereon, includes a base and several continuously connected walls extending from the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components.

Abstract: A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.

Abstract: An exemplary objective holder engages with a PCB substrate having an image sensor and several passive components arranged thereon. The passive components surround the image sensor. The objective includes a lens barrel extending from a side of a base, and a plurality of walls extending from an opposite side of the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components therein. A transparent cover is received in the objective holder between the lens barrel and the chamber. An adhesive is used to connect the objective holder to the PCB substrate. The PCB substrate is rested on the walls. At least one of the notches communicates the chamber to an exterior for outgassing and is sealed by a mass of sealing material after a heating process of the adhesive.

Abstract: A camera module includes a circuit board of a grounding pad, a lens module, and a voice-coil motor. The voice-coil motor for receiving and driving the lens module automatically focus comprises a main body, a metallic casing and a grounding structure. The metallic casing covers the main body. After electrically grounding by connecting with the grounding pad of the circuit board, the grounding structure connects with the metallic casing and the circuit board. With the grounding structure, the metallic casing can be grounded. Thereby, prevent external electromagnetic waves from affecting electrical signals communicated between the camera module and the circuit board.

Abstract: A camera module includes a circuit board, an image sensor chip, a lens module and a connecting member. The image sensor chip is disposed on the circuit board. The connecting member is adhered to the circuit board and surrounds the image sensor chip. The connecting member has four sidewalls, and a bottom wall connected with the four sidewalls. A protrusion extends upward from a top portion of each sidewall. The lens module includes a lens holder, a lens barrel partially received in and engaged with the lens holder and at least one lens received in the lens barrel. The lens holder defines four corresponding recesses formed on a bottom portion thereof and receives the protrusions therein. Thus, the lens holder of the lens module can be detachably fixed on the connecting member.

Abstract: An exemplary objective holder engages with a PCB substrate having an image sensor and several passive components arranged thereon. The passive components surround the image sensor. The objective includes a lens barrel extending from a side of a base, and a plurality of walls extending from an opposite side of the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components therein. A transparent cover is received in the objective holder between the lens barrel and the chamber. An adhesive is used to connect the objective holder to the PCB substrate. The PCB substrate is rested on the walls. At least one of the notches communicates the chamber to an exterior for outgassing and is sealed by a mass of sealing material after a heating process of the adhesive.

Abstract: An exemplary objective holder for engaging with a PCB substrate having an image sensor and several passive components arranged thereon, includes a base and several continuously connected walls extending from the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components.

Abstract: A camera module includes a circuit board (11), a lens module (10) mounted on the circuit board, an electromagnetic interference shielding casing (12) surrounding the lens module and the circuit board, and a electrically conductive sheet (13) being electrically connected to the electromagnetic interference shielding casing. The circuit board forms at least one grounding tab (111) thereon. The electrically conductive sheet extends from a lateral edge of the circuit board and electrically connects the at least one grounding tab with the electromagnetic interference shielding casing. The electrically conductive sheet includes a basewall (131) connected to the circuit board and at least one sidewall (133) bending from the basewall. The at least one sidewall extends into a gap defined between the electromagnetic interference shielding casing and the lens module and electrically connected to the electromagnetic interference shielding casing.

Abstract: A camera module includes a lens module including a holder and configured for imaging, an image sensor module received in the holder of the lens module and configured for capturing images, and a protective film adhered to an outer surface of the lens module. Due to the protective film, the outer and inner screw threads of the barrel and the holder are insulated from the outside. As such, use of the protective film maintains the quality of image produced by the camera module.

Abstract: An exemplary camera module includes a lens module and a lens holder. The lens module is coupled with the lens holder using threads. The thread coupling section between the lens module and the lens holder is filled with a damping oil for sealing the thread coupling section.

Abstract: A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.

Abstract: Maintaining photoresist thickness and uniformity over a substrate that includes various cavities presents problems, such as preventing distortion of features in the resist image close to cavity edges. These problems have been overcome by laying down the photoresist as two separate layers. The first layer is used to eliminate or reduce problems associated with the presence of the cavities. The second layer is processed in the normal way and does not introduce distortions close to a cavity's edge. A first embodiment introduces some liquid into the cavity before laying down the first layer while the second embodiment etches away part of the first layer before applying the second one. Application of the process to the formation of a cantilever that overhangs a cavity is also described.

Abstract: Maintaining photoresist thickness and uniformity over a substrate that includes various cavities presents problems, such as preventing distortion of features in the resist image close to cavity edges. These problems have been overcome by laying down the photoresist as two separate layers. The first layer is used to eliminate or reduce problems associated with the presence of the cavities. The second layer is processed in the normal way and does not introduce distortions close to a cavity's edge. A first embodiment introduces some liquid into the cavity before laying down the first layer while the second embodiment etches away part of the first layer before applying the second one. Application of the process to the formation of a cantilever that overhangs a cavity is also described.