Patents by Inventor Su Tseng

Su Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128211
    Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 18, 2024
    Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
  • Publication number: 20240128143
    Abstract: Provided are a package structure and a method of forming the same. The method includes: forming an interconnect structure on a substrate; performing a laser grooving process to form a first opening in the interconnect structure and form a debris layer on a sidewall of the first opening in a same step; forming a protective layer to fill in the first opening and cover the debris layer and the interconnect structure; patterning the protective layer to form a second opening, wherein the second opening is spaced from the debris layer by the protective layer; performing a planarization process on the protective layer to expose a topmost contact pad of the interconnect structure; and performing a mechanical dicing process through the second opening to form a third opening in the substrate and cut the substrate into a plurality of semiconductor dies.
    Type: Application
    Filed: February 1, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Hsieh, Yu-Jin Hu, Hua-Wei Tseng, An-Jhih Su, Der-Chyang Yeh
  • Patent number: 5230609
    Abstract: An air brake system for a vehicle including a valve disposed between a fuel tank and a fuel pump and a cylinder of an engine for switching fuel flow from the fuel pump to either the fuel tank or the cylinder, another valve coupled between the cylinder and the air tank for supplying pressurized air from the cylinder to the air tank, the other valve being closed when fuel flows into the cylinder and opened in order to introduce the pressurized air to the air tank.
    Type: Grant
    Filed: February 4, 1992
    Date of Patent: July 27, 1993
    Inventors: Chei-Su Tseng, Lain-Chei Tseng
  • Patent number: 4881154
    Abstract: An umbrella handle with a pivotable torch, in which two dry batteries are received on both sides of the umbrella shift. The wiring of the handle is such that when the torch is turned over a specific angle, it is switched on. This structure optimally utilize the available space and minimize the size of the handle.
    Type: Grant
    Filed: May 17, 1988
    Date of Patent: November 14, 1989
    Inventors: Su Tseng, Wan S. Chien