Abstract: A transparent display device comprises: a first substrate including a display area and first to fourth bezel areas surrounding the display area, wherein the display area includes a plurality of pixel regions each including an emitting portion and a transparent portion; a second substrate facing the first substrate; a transparent dam between the first and second substrates and in the first to fourth bezel areas; a first pad electrode on the first substrate and in the first bezel area; and a first color filter pattern on the second substrate and in the first bezel area.

Abstract: A transparent display device comprises: a first substrate including a display area and first to fourth bezel areas surrounding the display area, wherein the display area includes a plurality of pixel regions each including an emitting portion and a transparent portion; a second substrate facing the first substrate; a transparent dam between the first and second substrates and in the first to fourth bezel areas; a first pad electrode on the first substrate and in the first bezel area; and a first color filter pattern on the second substrate and in the first bezel area.

Abstract: A lens may include: a lens part including an incidence surface onto which light is incident and a emission surface through which the light incident onto the incidence surface is emitted, and an outer surface which reflects the light incident onto the incidence surface toward the emission surface; and a holder part including a lens housing integrally connected with edge of the emission surface and surrounds an outer peripheral of the lens part, and at least one alignment protrusion located at a lower portion of the lens housing.

Abstract: An optical semiconductor lighting apparatus according to exemplary embodiments of the present invention provides a heat radiation member having a heat radiation plate where heat radiation fins are disposed radially, a cooling member disposed in an internal space at the center part of the heat radiation plate which inner curved portions of the heat radiation fins form, a light emitting member coupled to a lower surface of the heat radiation plate, and a cover coupled to the outer edge of the heat radiation member while covering the cooling member wherein the heat radiation fins comprise a first heat radiation fin and a second heat radiation fin which is lower than the first heat radiation fin.

Abstract: An optical semiconductor lighting apparatus including an upper part including a cover and a cooling member coupled to a lower surface of the cover and a lower part including a housing forming an inner space, a heat radiation member coupled to a lower side of the housing, and a light emitting member coupled to a lower surface of the heat radiation member. The upper part is mounted on top of the lower part and the cooling member is disposed over the heat radiation member at a predetermined distance.

Abstract: A light emitting diode (LED) lighting apparatus includes: a power supply unit configured to convert AC current and/or voltage into DC current and/or voltage and output the converted DC current and/or voltage, a light emitting module comprising a printed circuit board (PCB) and a plurality of LEDs disposed on a first side of the PCB, wherein the light emitting module is configured to receive the DC current from the power supply unit, a fan module configured to receive the DC voltage from the power supply unit, and a temperature sensor configured to generate temperature information and transmit the temperature information to the fan module. Moreover, the temperature sensor is disposed on the PCB.

Abstract: An optical semiconductor light apparatus includes: a first light emitting block including one or more first light emitting modules; a junction box formed on one side surface of the first light emitting block and fastened to an end portion of a column; and at least one second light emitting block disposed on the other side surface of the first light emitting block and including one or more second light emitting modules, wherein the first and second light emitting modules are formed on one side thereof with one or more optical semiconductor devices and on the other side thereof with a plurality of heat dissipation fins, and the heat dissipation fins are received in the first and second light emitting blocks and formed in a direction in which the second light emitting block is coupled to the first light emitting block.

Abstract: An optical semiconductor illuminating apparatus includes a light emitting module including semiconductor optical elements, a casing part disposed over the light emitting module and having a switching mode power supply (SMPS) embedded therein, a first airtightness part including a packing frame fixed to an outer side of an edge of a communication slot penetrating through a side surface of the casing part, and a second airtightness part provided to an upper side of the casing part.

Abstract: An optical semiconductor illuminating apparatus includes a housing configured to receive power from one side thereof and comprising a first area, a heat dissipation base extending from the housing and comprising a second area smaller than the first area, and a light emitting module comprising at least one optical semiconductor device disposed on a portion of the housing and the heat dissipation base, and comprising a third area smaller than the first area and larger than the second area, in which the housing forms an overlap region comprising a fourth area overlapping the light emitting module, and the light emitting module is electrically connected to a power source through the overlap region.

Abstract: A lighting apparatus includes a housing, a light emitting module disposed on an open region at a first side of the housing, a heat sink unit disposed within the housing to absorb and discharge heat from the light emitting module, and at least one subsidiary heat pipe independent of the heat sink unit and disposed on the heat sink base. The light emitting module includes a heat sink base on which a semiconductor optical device is disposed.

Abstract: An optical semiconductor illuminating apparatus includes a heat dissipating base having a first side, a second side opposed to the first side, and at least one edge therebetween, a light emitting module connected to the first side of the heat dissipating base and heat dissipating fins protruding from the second side of the heat dissipating base. The heat dissipating fins extend beyond at least one edge of the heat dissipating base.

Abstract: Embodiments of the invention provide an optical semiconductor illuminating apparatus, which includes a heat dissipating base; a light emitting module comprising at least one semiconductor light emitting device and mounted on a lower side of the heat dissipating base; and a plurality of heat dissipating fins each having opposite edges protruding from opposite sides of the heat dissipating base and being mounted on an upper surface of the heat dissipating base.

Abstract: A lighting apparatus includes a housing, a light emitting module disposed on an open region at one side of the housing, and a heat sink unit placed within the housing to absorb and discharge heat from the light emitting module. The light emitting module includes a heat sink base on which a semiconductor optical device is mounted. The heat sink unit includes at least one main heat pipe having one side adjoining the heat sink base and a heat sink block adjoining the other side of the main heat pipe to cooperate with the main heat pipe.

Abstract: Disclosed herein is an optical semiconductor based illuminating apparatus including light emitting modules including at least one semiconductor optical device; and a housing enclosing one side surface of at least one of the light emitting modules. This optical semiconductor based illuminating apparatus may promote convenience for checking and repairing, simply perform separation and fastening, have excellent waterproofing characteristics and durability, prevent accidents such as short circuit and electric shock improve heat radiation performance, prevent introduction of foreign materials, be easily cleaned and maintained, reliably provide power of a main power line to a plurality of light emitting modules, and utilize a space and secure reliability of a product regardless of a size and a shape of a power supply embedded therein.

Abstract: An optical semiconductor based illuminating apparatus including a housing having an opening portion, a lighting unit disposed adjacent to the housing that includes at least one optical semiconductor, a power supply mounted within the housing that supplies power to the lighting unit, and a gate unit connected to the opening part that opens and shuts the inner housing.

Abstract: Embodiments of the invention provide an optical semiconductor illuminating apparatus, which includes a heat dissipating base; a light emitting module comprising at least one semiconductor light emitting device and mounted on a lower side of the heat dissipating base; and a plurality of heat dissipating fins each having opposite edges protruding from opposite sides of the heat dissipating base and being mounted on an upper surface of the heat dissipating base.

Abstract: An optical semiconductor lighting apparatus includes: a light emitting module including one or more semiconductor optical devices; a switching mode power supply (SMPS) connected to the light emitting module; a housing disposed to be adjacent to the light emitting module, in which the housing has both ends opened and accommodates the SMPS; a first heat dissipation unit disposed at an inner side of the housing; and a second heat dissipation unit disposed radially at an outer side of the housing and formed from an outer side of one end portion of the housing to the edge of the light emitting module. The first heat dissipation unit includes a plurality of heat dissipation plates through which the heat pipe penetrates, and a plurality of vent portions formed on the heat dissipation plates.

Abstract: Disclosed herein is an optical semiconductor based illuminating apparatus including light emitting modules including at least one semiconductor optical device; and a housing enclosing one side surface of at least one of the light emitting modules. This optical semiconductor based illuminating apparatus may promote convenience for checking and repairing, simply perform separation and fastening, have excellent waterproofing characteristics and durability, prevent accidents such as short circuit and electric shock improve heat radiation performance, prevent introduction of foreign materials, be easily cleaned and maintained, reliably provide power of a main power line to a plurality of light emitting modules, and utilize a space and secure reliability of a product regardless of a size and a shape of a power supply embedded therein.

Abstract: The present invention provides an optical semiconductor-based lighting apparatus. The lighting apparatus includes a housing, a light emitting module disposed on an open region at one side of the housing, and a heat sink unit placed within the housing to absorb and discharge heat from the light emitting module. The light emitting module includes a heat sink base on which a semiconductor optical device is mounted. The heat sink unit includes at least one main heat pipe having one side adjoining the heat sink base and a heat sink block adjoining the other side of the main heat pipe to cooperate with the main heat pipe.

Abstract: An optical semiconductor based illuminating apparatus including a housing having an opening portion, a lighting unit disposed adjacent to the housing that includes at least one optical semiconductor, a power supply mounted within the housing that supplies power to the lighting unit, and a gate unit connected to the opening part that opens and shuts the inner housing.