Abstract: An error detection code generation circuit of a semiconductor device includes a first cyclic redundancy check (CRC) engine, a second CRC engine and an output selection engine. The first CRC engine generates first error detection code bits using a first generation matrix, based on a plurality of first unit data and first DBI bits in response to a mode signal. The second CRC engine generates second error detection code bits using a second generation matrix, based on a plurality second unit data and second DBI bits, in response to the mode signal. The output selection engine generates final error detection code bits by merging the first error detection code bits and the second error detection code bits in response to the mode signal. The first generation matrix is the same as the second generation matrix.

Abstract: A semiconductor memory device includes a command decoder configured to generate an auto-sync signal in response to a command for writing data at a memory cell or reading data from a memory cell, and an internal data clock generating circuit configured to phase synchronize a second clock, having a clock frequency higher than a clock frequency of a first clock, with the first clock in response to the auto-sync signal.

Abstract: A semiconductor memory device includes a command decoder configured to generate an auto-sync signal in response to a command for writing data at a memory cell or reading data from a memory cell, and an internal data clock generating circuit configured to phase synchronize a second clock, having a clock frequency higher than a clock frequency of a first clock, with the first clock in response to the auto-sync signal.

Abstract: A clock pattern generating method of a semiconductor memory device is provided. The method includes generating the same clock pattern through a plurality of detection clock output pins when an output selection control signal is in a first state and generating clock patterns different from each other through the plurality of detection clock output pins when the output selection control signal is in a second state different from the first state.

Abstract: An electronic device includes a memory device including a power switch configured to provide one of a first voltage and a second voltage to an internal circuit in response to a control command. A power management device is configured to generate the first voltage, the second voltage, and the control command and to provide the first voltage, the second voltage, and the control command to the memory device. The power switch provides the second voltage to the internal circuit while a level of the first voltage is changed and provides the first voltage to the internal circuit after a level change of the first voltage is completed.

Abstract: A method of operating a memory controller, memory devices including a master memory device and slave memory devices, a back channel bus coupling the master memory device to the slave memory devices and a channel coupling the memory controller to the memory devices is provided as follows. A memory command is received by the memory devices from the memory controller. An internal command is generated and outputted by the master memory device. The internal command is received by the slave memory devices. The internal command is transmitted to the slave memory devices through the back channel bus.

Abstract: A semiconductor memory device includes a command decoder configured to generate an auto-sync signal in response to a command for writing data at a memory cell or reading data from a memory cell, and an internal data clock generating circuit configured to phase synchronize a second clock, having a clock frequency higher than a clock frequency of a first clock, with the first clock in response to the auto-sync signal.

Abstract: An electronic device includes a memory device including a power switch configured to provide one of a first voltage and a second voltage to an internal circuit in response to a control command. A power management device is configured to generate the first voltage, the second voltage, and the control command and to provide the first voltage, the second voltage, and the control command to the memory device. The power switch provides the second voltage to the internal circuit while a level of the first voltage is changed and provides the first voltage to the internal circuit after a level change of the first voltage is completed.

Abstract: A clock pattern generating method of a semiconductor memory device is provided. The method includes generating the same clock pattern through a plurality of detection clock output pins when an output selection control signal is in a first state and generating clock patterns different from each other through the plurality of detection clock output pins when the output selection control signal is in a second state different from the first state.

Abstract: A method of operating a memory controller, memory devices including a master memory device and slave memory devices, a back channel bus coupling the master memory device to the slave memory devices and a channel coupling the memory controller to the memory devices is provided as follows. A memory command is received by the memory devices from the memory controller. An internal command is generated and outputted by the master memory device. The internal command is received by the slave memory devices. The internal command is transmitted to the slave memory devices through the back channel bus.

Abstract: A memory device includes an output pin, a mode register, a signal generator configured to generate a detection clock output signal including one of a random data pattern and a hold data pattern in response to first and second control signals from the mode register, and output the detection clock output signal through the output pin. The random data pattern includes pseudo-random data generated by the memory device. The hold data pattern is a fixed pattern pre stored in the memory device. The detection clock output signal is used for a clock and data recovery operation.

Abstract: An error detection code generation circuit of a semiconductor device includes a first cyclic redundancy check (CRC) engine, a second CRC engine and an output selection engine. The first CRC engine generates first error detection code bits using a first generation matrix, based on a plurality of first unit data and first DBI bits in response to a mode signal. The second CRC engine generates second error detection code bits using a second generation matrix, based on a plurality second unit data and second DBI bits, in response to the mode signal. The output selection engine generates final error detection code bits by merging the first error detection code bits and the second error detection code bits in response to the mode signal. The first generation matrix is the same as the second generation matrix.

Abstract: An electronic device includes a memory device including a power switch configured to provide one of a first voltage and a second voltage to an internal circuit in response to a control command. A power management device is configured to generate the first voltage, the second voltage, and the control command and to provide the first voltage, the second voltage, and the control command to the memory device. The power switch provides the second voltage to the internal circuit while a level of the first voltage is changed and provides the first voltage to the internal circuit after a level change of the first voltage is completed.

Abstract: A memory system includes a semiconductor memory device and a memory controller. The semiconductor memory device includes a plurality of dynamic memory cells. The memory controller controls the semiconductor memory device. The memory controller applies an auto-refresh command to the semiconductor memory device at each refresh interval of the semiconductor memory device such that the semiconductor memory performs a refresh operation in a normal mode, and does not apply the auto-refresh command to the semiconductor memory device during a self-refresh interval in which the semiconductor memory performs a self-refresh operation. After the semiconductor memory device exits from the self-refresh interval, the memory controller adjusts an application of the auto-refresh command in the normal mode by reflecting information of the self-refresh interval.

Abstract: Provided is a method of refreshing a memory device by controlling a self-refresh cycle according to temperature. In the method, first self-refresh and second self-refresh are performed according to inner temperature of the memory device and a self-refresh cycle is controlled such that an all-bank-refresh (ABR) operation is not performed simultaneously with the start of the second self-refresh. The ABR operation is performed at the start of third self-refresh when the sum of a section of the first self-refresh in which the ABR operation is not performed and a section of the second self-refresh in which the ABR operation is not performed corresponds to a self-refresh cycle.

Abstract: Provided is a method of refreshing a memory device by controlling a self-refresh cycle according to temperature. In the method, first self-refresh and second self-refresh are performed according to inner temperature of the memory device and a self-refresh cycle is controlled such that an all-bank-refresh (ABR) operation is not performed simultaneously with the start of the second self-refresh. The ABR operation is performed at the start of third self-refresh when the sum of a section of the first self-refresh in which the ABR operation is not performed and a section of the second self-refresh in which the ABR operation is not performed corresponds to a self-refresh cycle.

Abstract: A memory module includes a first memory group including a plurality of first semiconductor memory devices, and a second memory group including a plurality of second semiconductor memory devices. The first semiconductor memory devices and the second semiconductor memory devices share a command/address bus. The first semiconductor memory devices perform a first operation in response to a command signal received by the first semiconductor memory devices from the command/address bus and the second semiconductor memory devices perform a second operation, different from the first operation, in response to the same command signal received by the second semiconductor memory devices from the command/address bus.

Abstract: A method of operating a semiconductor memory device is provided as follows. The semiconductor memory device receive a bank address for a first bank including a first word line, a second word line and a third word line. The semiconductor memory device receive a first row address to activate the first world line for a read operation or a write operation. The semiconductor memory device generates a second row address to refresh a plurality of memory cells associated with the second word line.

Abstract: A memory system includes a semiconductor memory device and a memory controller. The semiconductor memory device includes a plurality of dynamic memory cells. The memory controller controls the semiconductor memory device. The memory controller applies an auto-refresh command to the semiconductor memory device at each refresh interval of the semiconductor memory device such that the semiconductor memory performs a refresh operation in a normal mode, and does not apply the auto-refresh command to the semiconductor memory device during a self-refresh interval in which the semiconductor memory performs a self-refresh operation. After the semiconductor memory device exits from the self-refresh interval, the memory controller adjusts an application of the auto-refresh command in the normal mode by reflecting information of the self-refresh interval.

Abstract: A semiconductor memory device includes a command decoder configured to generate an auto-sync signal in response to a command for writing data at a memory cell or reading data from a memory cell, and an internal data clock generating circuit configured to phase synchronize a second clock, having a clock frequency higher than a clock frequency of a first clock, with the first clock in response to the auto-sync signal.