Abstract: A circuit board and an electronic device are provided. The circuit board includes a circuit board body (10) and a shielding film layer (11), and further includes a dielectric layer (12), where the dielectric layer (12) is arranged between the circuit board body (10) and the shielding film layer (11).

Abstract: The present application provides an ultrathin shielding film of high shielding effectiveness, comprising two or more solid shielding layers. An electrically-conductive adhesive layer is coated onto the outer surface at one side of the solid shielding layers, and one or more insulation film layers are formed on the outer surface at the other side of the solid shielding layers. A carrier film layer is provided on the outer surface of the insulation film layers. A protective film covers the lower surface of the electrically-conductive adhesive layer. The present application further discloses a manufacturing method of an ultrathin shielding film of high shielding effectiveness.