Patents by Inventor Subhas C. Bose Jayappa Veeramma

Subhas C. Bose Jayappa Veeramma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Breakdown voltage for power devices
    Patent number: 8093652
    Abstract: A power device includes a semiconductor substrate of first conductivity having an upper surface and a lower surface. An isolation diffusion region of second conductivity is provided at a periphery of the substrate and extends from the upper surface to the lower surface of the substrate. The isolation diffusion region has a first surface corresponding to the upper surface of the substrate and a second surface corresponding to the lower surface. A peripheral junction region of second conductivity is formed at least partly within the isolation diffusion region and formed proximate the first surface of the isolation diffusion region. First and second terminals are provided.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: January 10, 2012
    Assignee: IXYS Corporation
    Inventors: Subhas C. Bose Jayappa Veeramma, Ulrich Kelberlau
  • Breakdown voltage for power devices
    Publication number: 20040119087
    Abstract: A power device includes a semiconductor substrate of first conductivity having an upper surface and a lower surface. An isolation diffusion region of second conductivity is provided at a periphery of the substrate and extends from the upper surface to the lower surface of the substrate. The isolation diffusion region has a first surface corresponding to the upper surface of the substrate and a second surface corresponding to the lower surface. A peripheral junction region of second conductivity is formed at least partly within the isolation diffusion region and formed proximate the first surface of the isolation diffusion region. First and second terminals are provided.
    Type: Application
    Filed: August 27, 2003
    Publication date: June 24, 2004
    Applicant: IXYS Corporation
    Inventors: Subhas C. Bose Jayappa Veeramma, Ulrich Kelberlau