Patents by Inventor Subramania S. Iyer

Subramania S. Iyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for precise multichip integration and product thereof
    Patent number: 6066513
    Abstract: Process for making an integrated circuit module and product thereof including a carrier supporting a plurality of precisely aligned semiconductor circuit chips having uniform thicknesses.
    Type: Grant
    Filed: October 2, 1998
    Date of Patent: May 23, 2000
    Assignee: International Business Machines Corporation
    Inventors: H. Bernhard Pogge, Subramania S. Iyer
  • Structure for precision multichip assembly
    Patent number: 6025638
    Abstract: Process for making an integrated circuit module and product thereof including a carrier supporting a plurality of precisely aligned semiconductor circuit chips having uniform thicknesses.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: February 15, 2000
    Assignee: International Business Machines Corporation
    Inventors: H. Bernhard Pogge, Subramania S. Iyer