Abstract: Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

Abstract: An apparatus is described. The apparatus includes a cold plate. The ruler factor cold plate is to receive heat from semiconductor chips of a electronic component that is to be plugged into an electronic system. The cold plate has at least one of: a) a linearly advancing physical interface, the linearly advancing physical interface to make physical contact with a corresponding linearly advancing physical interface of a cooling component of the electronic system, the physical contact to create a thermal path from the cold plate to the cooling component; b) first fingers on a first face of the cold plate to make spring-force thermal contact with the semiconductor chips of the electronic component and second fingers on an opposite second face of the cold plate to make spring-force thermal contact with the respective semiconductor chips of another, neighboring electronic component.