Abstract: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

Abstract: A fluid flow system and a method for detecting air bubble and liquid are provided. The fluid flow system comprises a force sensor configured to monitor at least one of an air bubble or an occlusion in a flow tube. The fluid flow system comprises a controller to execute the method. The controller is configured to monitor an output signal of a force sensor of the fluid flow system, and the output signal comprises an Alternating Current (AC) component and a Direct Current (DC) component, and detect a change in the output signal to a new output signal based on a number of transitions to the new output signal, and a time duration of the new output signal. The controller compares the change in the output signal with one of a predefined number of transitions or a predefined time and determines a new threshold when the change in the output signal exceeds one of the predefined number of transitions or the predefined time.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: A fluid flow system and a method for detecting air bubble and liquid are provided. The fluid flow system comprises a force sensor configured to monitor at least one of an air bubble or an occlusion in a flow tube. The fluid flow system comprises a controller to execute the method. The controller is configured to monitor an output signal of a force sensor of the fluid flow system, and the output signal comprises an Alternating Current (AC) component and a Direct Current (DC) component, and detect a change in the output signal to a new output signal based on a number of transitions to the new output signal, and a time duration of the new output signal. The controller compares the change in the output signal with one of a predefined number of transitions or a predefined time and determines a new threshold when the change in the output signal exceeds one of the predefined number of transitions or the predefined time.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

Abstract: A fluid flow system and a method for detecting air bubble and liquid are provided. The fluid flow system comprises a force sensor configured to monitor at least one of an air bubble or an occlusion in a flow tube. The fluid flow system comprises a controller to execute the method. The controller is configured to monitor an output signal of a force sensor of the fluid flow system, and the output signal comprises an Alternating Current (AC) component and a Direct Current (DC) component, and detect a change in the output signal to a new output signal based on a number of transitions to the new output signal, and a time duration of the new output signal. The controller compares the change in the output signal with one of a predefined number of transitions or a predefined time and determines a new threshold when the change in the output signal exceeds one of the predefined number of transitions or the predefined time.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

Abstract: Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: Systems, apparatuses, and methods are disclosed for sensing a force applied by an external source. An example system comprises a substrate comprising a plurality of electrical contact pads disposed on a first surface of the substrate. The system further comprises a force sensing device disposed on a second surface of the substrate, the second surface opposite the first surface. The system further comprises a housing disposed on the second surface of the substrate. The housing defines an aperture that provides a common coupling interface. The common coupling interface provides a common path for the force to be transmitted to the force sensing device either through a first coupling or a second coupling different from the first coupling.

Abstract: Example systems, apparatuses and methods are disclosed for sensing a force applied by an external source. An example system comprises a substrate comprising a plurality of electrical contact pads disposed on a first surface of the substrate. The system further comprises a force sensing device disposed on a second surface of the substrate, the second surface opposite the first surface. The system further comprises a housing disposed on the second surface of the substrate. The housing defines an aperture that provides a common coupling interface. The common coupling interface provides a common path for the force to be transmitted to the force sensing device either through a first coupling or a second coupling different from the first coupling.