Abstract: A giant magnetoresistive (GMR) head contains an overcoat layer consisting of silicon dioxide or silicon nitride. These materials have a coefficient of thermal expansion (CTE) that is less than alumina, which is conventionally used for the overcoat layer. As a result, the overcoat layer exhibits a smaller temperature-induced protrusion when the head heats up from friction with the passing air stream. The process of forming the head includes forming a recess in the overcoat layer that reduces the stress on the poles and improves the performance of the head. The process includes depositing a seed layer over the overcoat layer in preparation to plating a metal mask layer with an opening where the recess is to be formed, wet chemical etching the seed layer through the opening in the mask layer and performing an ion milling process to remove any remaining traces of the seed layer.

Abstract: A method using a CMP resistant hardmask in a process of fabricating a pole piece for a magnetic head is described. A set of layers used as the mask for milling the pole piece preferably includes a CMP resistant hardmask of silicon dioxide, a resist hardmask, an upper hardmask and a photoresist mask respectively. A multi-step reactive-ion etching (RIE) process is preferably used to sequentially remove the excess materials in the layer stack to ultimately define the multilayer mask for the pole piece. The excess pole piece material is then milled away. The wafer is then refilled with a nonmagnetic material such as alumina. A CMP liftoff is used to remove the resist hardmask. The material for the CMP resistant hardmask is selected to have a high resistance to the CMP liftoff process in comparison to the refill material. The CMP resistant hardmask is preferably then removed by a RIE process.

Abstract: An improved method of fabricating thin-film magnetic recording heads is disclosed. For the method, one or more layers for a feature (such as a read element, a write element, etc) are deposited and patterned. A layer of adhesion material is then deposited on the layers of the feature. The adhesion material provides better adhesion to a Diamond-Like Carbon (DLC) layer and to the underlying feature surface, such as monolithic Silicon (Si) or Titanium (Ti). A layer of DLC material is then deposited on the layer of adhesion material. The steps of depositing the layer of adhesion material and the layer of DLC material are repeated more than one time. Thus, more than one set of alternating layers of adhesion material and DLC material are deposited on the layers of the feature to form a multi-layer protective coating on the feature.

Abstract: A perpendicular write head includes a beveled main pole having corners defining a track width and having a planarized surface and encapsulated on either side thereof and below by an alumina layer, the alumina layer having a polished surface and extending above the main pole on either side thereof as steps.

Abstract: A perpendicular write head includes a main pole comprising a Durimide/Alumina hard mask formed over a laminate layer process to form the main pole without using a liftoff or chemical mechanical polishing process, thereby avoiding rounding corners of the pole, the main pole being controlled in shape for improved control of critical dimension of track width and angle of the bevel to avoid undesirable adjacent track writing.

Abstract: A magnetic write head for use in a data recording system having first and second magnetic pole, the first pole having a P1 pedestal. An electrically conductive coil passes through a space between the first and second poles for inducing a magnetic flux through the yoke formed by the first and second poles. A bi-layer insulation layer disposed between the poles includes a layer of photoresist for preventing voids and a layer of alumina formed thereover to provide a structural brace to prevent recession of the P1 pedestal during manufacturing operations such as soda blast.

Abstract: A method and apparatus for defining leading edge taper of a write pole tip is disclosed. The fabrication process uses reactive ion etching to fabricate LET with tight control of the placement of LET's edge and to achieve higher angle for providing a higher effective write field at the pole tip while minimizing ATI for high-density perpendicular recording. The placement of a resist's edge is used to define the LET's edge and a CMP process is used to provide a planar surface for the fabrication of the write pole.

Abstract: A perpendicular write head for writing data onto tracks includes a main pole, a trailing shield and bilayer trailing shield gap layer between the main pole and the trailing shield and improving writing and track width control.

Abstract: The fabrication of the read head sensor components where chemical mechanical polishing (CMP) stop layer is deposited above the sensor layers, a first reactive ion etch (RIE) layer and a second RIE layer are deposited, where the second RIE layer is etchable with a different ion species than the first RIE layer. A stencil layer is then deposited and patterned to create an etching stencil having the desired magnetic read track width of the sensor. An RIE step is then conducted in which the second RIE layer is etched. An RIE step for the first RIE layer is then conducted with a different ion species. Thereafter, the sensor layers are milled where the remaining portions of the first and second RIE layers act as a milling mask. A CMP assisted liftoff step is then conducted in which the remaining portions of the ion milling mask are removed.

Abstract: A giant magnetoresistive (GMR) head contains an overcoat layer consisting of silicon dioxide or silicon nitride. These materials have a coefficient of thermal expansion (CTE) that is less than alumina, which is conventionally used for the overcoat layer. As a result, the overcoat layer exhibits a smaller temperature-induced protrusion when the head heats up from friction with the passing air stream. The process of forming the head includes forming a recess in the overcoat layer that reduces the stress on the poles and improves the performance of the head. The process includes depositing a seed layer over the overcoat layer in preparation to plating a metal mask layer with an opening where the recess is to be formed, wet chemical etching the seed layer through the opening in the mask layer and performing an ion milling process to remove any remaining traces of the seed layer.

Abstract: A method of enhancing alignment marks defined in a relatively thin layer on a wafer by etching the alignment marks into an underlying alignment mark transfer layer is described. The target area for the alignment marks is prepared by depositing material for the transfer layer. In alternative embodiments an oversized trench is formed in the target area prior to the deposition of the transfer layer. The alignment marks can fabricated in the layer(s) deposited by the existing process or alternatively, the original layers can be removed and replaced with a layer of material selected to have comparable etching properties (definition layer).

Abstract: A method for constructing a tapered write pole, the method including the use of a bilayer hard mask.

Abstract: A magnetoresistive read/write head having a first layer of alumina and a second layer of silicon dioxide overlaying a P3 layer of the head. In a preferred embodiment, the silicon dioxide layer is recessed away from an Air Bearing Surface (ABS) to reduce protrusion of a P2 layer and the P3 layer in the head, and to reduce degradation in the magnetic properties of the pole tips of the P2 and P3 layer ends.

Abstract: During manufacture, a magnetoresistive sensor having a ferromagnetic free layer is commonly provided with a tantalum cap layer. The tantalum cap layer provides protection to the sensor during manufacture and then is typically removed after performing annealing. The removal of the tantalum cap with a fluorine reactive ion etch leaves low volatility tantalum/fluorine byproducts. The present invention provides a method of using an argon/hydrogen reactive ion etch to remove the tantalum/fluorine byproducts. The resulting sensor has far less damage resulting from the presence of the fluorine byproducts.

Abstract: A system and method are provided for manufacturing a coil structure for a magnetic head. Initially, an insulating layer is deposited with a photoresist layer deposited on the insulating layer. Moreover, a silicon dielectric layer is deposited on the photoresist layer as a hard mask. The silicon dielectric layer is then masked. A plurality of channels is subsequently formed in the silicon dielectric layer using reactive ion etching (i.e. CF4/CHF3). The silicon dielectric layer is then used as a hard mask to transfer the channel pattern in the photoresist layer using reactive ion etching with, for example, H2/N2/CH3F/C2H4 reducing chemistry. To obtain an optimal channel profile with the desired high aspect ratio, channel formation includes a first segment defining a first angle and a second segment defining a second angle. Thereafter, a conductive seed layer is deposited in the channels and the channels are filled with a conductive material to define a coil structure.

Abstract: A magnetic head having an air bearing surface (ABS) and a first pole tip. A second pole tip is spaced apart from and facing the upper end of the first pole tip across a write gap. A bump extends into a portion of the upper end of the first pole tip and a portion of the bottom end of the second pole tip, the bump being positioned away from the ABS. The bump defines a throat height of the first and second pole tips.

Abstract: A method of making a magnetic write head assembly, which has a head surface and a track width, comprises the steps of forming a first pole piece layer of a first pole piece which has a pole tip portion, a back gap portion which is recessed from the head surface and a yoke portion which is located between the pole tip and back gap portions, forming an insulation stack with at least one coil layer embedded therein on the yoke portion of the first pole piece layer, forming a pedestal of the first pole piece on the pole tip portion of the first pole piece layer, forming a write gap layer on the pedestal, forming on a substantially planar surface a first component of a second pole piece on the write gap layer with the width at the head surface which is greater than the track width and with a throat height which extends from the head surface into the head assembly where the first and second pole pieces first commence to separate after the head surface, forming a second component of the second pole piece which has a

Abstract: A method for fabrication of magnetic write heads for disk drives in which a P1 layer is formed having a P1 Protrusion, the P1 Protrusion having a longitudinal reference axis. A gap layer is deposited on the P1 Protrusion and a layer of fill material is deposited on the gap layer. The fill material layer is shaped to form a mold which surrounds a hollow which is aligned with the longitudinal axis of the P1 Protrusion. This hollow in the fill material layer is filled with P2 pole material to form a P2 pole which is then automatically substantially aligned with the longitudinal axis of the P1 Protrusion.

Abstract: During manufacture, a magnetoresistive sensor having a ferromagnetic free layer is commonly provided with a tantalum cap layer. The tantalum cap layer provides protection to the sensor during manufacture and then is typically removed after performing annealing. The removal of the tantalum cap with a fluorine reactive ion etch leaves low volatility tantalum/fluorine byproducts. The present invention provides a method of using an argon/hydrogen reactive ion etch to remove the tantalum/fluorine byproducts. The resulting sensor has far less damage resulting from the presence of the fluorine byproducts.

Abstract: Apparatus for retaining a wafer having improved wafer and chuck edge protection, contains an protection ring that circumscribes a pedestal and is biased to be in constant contact with the backside of the wafer. A biasing element uniformly biases the protection ring into contact with the circumferential edge of the wafer. The protection ring has an annular plan form that circumscribes an electrostatic chuck for retaining the wafer in a stationery position. Vertical travel of the ring is restricted by a hard stop that is formed by a portion of a focus ring which overhangs the protection ring. After a wafer is placed upon the chuck and the chucking force enabled, the chucking force easily overcomes the bias force upon the protection ring and the wafer rests upon the chuck support surface.