Patents by Inventor Suehiro Kamizono

Suehiro Kamizono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Continuous plating method of filament bundle and apparatus therefor
    Patent number: 6892667
    Abstract: A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: May 17, 2005
    Assignee: Nagoya Mekki Kogyo Kabushiki Kaisha
    Inventors: Nobuyuki Suganuma, Hiroshi Kobayashi, Suehiro Kamizono, Tom Wong
  • Continuous plating method of filament bundle and apparatus therefor
    Publication number: 20050089639
    Abstract: A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.
    Type: Application
    Filed: November 15, 2004
    Publication date: April 28, 2005
    Applicant: NAGOYA MEKKI KOGYO KABUSHIKI KAISHA
    Inventors: Nobuyuki Suganuma, Hiroshi Kobayashi, Suehiro Kamizono, Tom Wong
  • Continuous plating method of filament bundle and apparatus therefor
    Publication number: 20030224111
    Abstract: A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.
    Type: Application
    Filed: November 26, 2002
    Publication date: December 4, 2003
    Applicant: NAGOYA MEKKI KOGYO KABUSHIKI KAISHA
    Inventors: Nobuyuki Suganuma, Hiroshi Kobayashi, Suehiro Kamizono, Tom Wong